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1)  polishing [英]['pɔliʃ]  [美]['pɑlɪʃ]
抛光
1.
Study of mechanical polishing of CVD diamond thick films;
CVD金刚石厚膜的机械抛光研究
2)  polish [英]['pɔlɪʃ]  [美]['pɑlɪʃ]
抛光
1.
Development of the Rotator Special for Autoclave Body Polish;
釜体抛光专用转罐机的研制
2.
The Design of a Self-oscillating Abrasive Water Jet Polisher of Economy Type;
经济型自激振荡磨料射流抛光机设计
3.
The design of the grinding liquid pulse shot flow polisher;
磨液脉冲射流抛光机设计
3)  lapping [英][læp]  [美][læp]
抛光
1.
Ultrasonic is applied in slider lapping.
在硬盘磁头抛光中加入超声波,可以提高材料去除率、降低表面粗糙度值、减小极尖沉降。
2.
The thickness of the slurry film in one lapping process with a kind of texturing plate surface was calculated as an example.
根据运动学分析,研究了磁头和抛光盘接触面之间速度场的分布;结合流体力学理论,将抛光盘表面的沟槽视为楔形滑块或阶梯轴承,研究了磁头和抛光盘接触面之间抛光液的流动行为。
3.
It is a contradiction to achieve a high material removal rate and a super smooth surface in lapping of magnetic head.
同时获得高去除率和超光滑平整的表面是硬盘磁头自由磨粒抛光的矛盾,研究自由磨粒抛光材料去除规律可以优化抛光工艺。
4)  Laser polishing
激光抛光
1.
Development and expectation of laser polishing technology;
激光抛光技术的发展与展望
2.
The principle and affecting factors of laser polishing of diamond films are disc ussed.
讨论了激光抛光金刚石膜机理、影响因素 ,分析了激光抛光金刚石膜理论模型、激光抛光后金刚石膜的粗糙度极限 ,提出要实现金刚石膜特别是厚膜的精密抛光须考虑激光辅助复合抛光或其它抛光工艺。
3.
Several factors affect the material removal rate of laser polishing process and polished surface roughness, such as laser energy density, wavelength, pulse width, incidente angle, scanning speed and scanning way of laser beam, material properties and structure and so on.
激光抛光是一种非接触式抛光方法。
5)  polished ceramic tile
抛光光砖
6)  photoetching
光抛光
1.
After treated the surface of NiNb2O6 photoelectrode by mechanical polishing +chemical etching + photoetching, the stable values of the differential capacitance of the spacecharge layer are measured,the relationship between flatband potential Vfb and pH value of the electrolyte is obtained,and the value of Vfb is compared with its theoretical calculating value.
对电极进行机械抛光加化学抛光加光抛光处理后,测得了NiNb2O6半导体光电极空间电荷层的微分电容的稳定值,得到了平带电势Vfb与电解液pH值间的关系,并与Vfb的理论计算值进行了比较。
2.
The affections of different surface treatments by mechanical polishing, chemical etching and photoetching to the properties of electrodes have also been discussed.
探讨了机械抛光、化学抛光和光抛光等不同表面处理方法对电极特性的影响。
补充资料:抛光
抛光
polishing

   利用柔性抛光工具和磨料颗粒或其他抛光介质对工件表面进行的修饰加工。工件经抛光后,前一道工序(如磨削、精车、精刨等)的加工痕迹被去掉,从而显出光洁的镜面,表面粗糙度可达Ra0.63~0.01微米。抛光一般去不掉余量,所以不能提高工件的尺寸精度或几何形状精度。经抛光的表面能减小残余拉应力值。抛光工具一般为用毛毡、厚帆布、皮革或棉织物等制成的抛光轮,轮缘涂敷由微粉磨料和油脂等均匀混合而成的抛光剂。磨料一般根据工件材料选取,如对钢件抛光时选用氧化铁粉末及刚玉,对铸铁件抛光时选用氧化铁粉末及碳化硅,对铝、铜件等抛光时选用氧化铬及金刚砂等。抛光介质一般为油脂,包括硬脂酸、煤油、石蜡等。在抛光过程中,有由硬脂酸等在金属表面形成氧化膜的化学作用,有由较细较软的磨料进行的磨削作用,另外,因抛光轮的高速而生的摩擦热使工作表面出现极薄的熔流层,也对原来粗糙的表面起磨平的作用。
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