1) dielectric properties
介电性能
1.
The sintering behavior and microwave dielectric properties of Mg_4(Ta_(1-x)V_x)_2O_9 ceramics;
Mg_4(Ta_(1-x)V_x)_2O_9陶瓷的烧结特性和微波介电性能
2.
Effect of doped Mg~(2+) and Mn~(2+) on the dielectric properties of BaTiO_3-metal composite system;
Mg~(2+)和Mn~(2+)掺杂对BaTiO_3-金属复合系介电性能的影响
3.
Preparation of Cd-doped BZCN thin film and its dielectric properties;
Cd掺杂BZCN薄膜的制备及其介电性能
2) dielectric property
介电性能
1.
Temperature and dielectric property of resin during RTM process;
RTM工艺中树脂固化温度与介电性能
2.
Correlations between dielectric property and modulated structure in the (Ta_2O_5)_(0.92)(TiO_2)_(0.08) system;
Ta_2O_5-TiO_2调制结构和介电性能相关性
3.
Effects of nickel addition on the microstructure and dielectric property of barium titanate powder and ceramic with excessive Ti;
掺镍对钛过量钛酸钡粉体及其陶瓷的结构及介电性能的影响
3) dielectric performance
介电性能
1.
Effect of Molecular Weight on Dielectric Performance of PMMA;
PMMA的摩尔质量对其介电性能的影响
2.
The dielectric performance,viscosity-temperature,moisture absorption,heat-resistance of novel modi-fied 5528 cyanate ester resin was investigated in this article.
对新型的5528改性氰酸酯树脂的介电性能、耐热性能、粘温特性和吸湿性能进行了研究,结果表明:5528氰酸酯树脂具有良好工艺性能,适合于湿法预浸和热熔预浸,介电性能优异,介电损耗正切值为0。
3.
Impact resistance and dielectric performance of the modified resin system were characterized and analyzed.
对聚醚酰亚胺增韧改性氰酸酯树脂体系的断面形态和冲击韧性进行分析,并对改性氰酸酯树脂体系的介电性能进行表征和分析。
4) dielectric
[英][,daii'lektrik] [美][,daɪɪ'lɛktrɪk]
介电性能
1.
The effect of excess PbO and MgO on dielectric property of PMN-PT;
过量PbO、MgO对PMN-PT陶瓷介电性能的影响
2.
Piezoelectric and dielectric properties and acoustic impedance of the composites with different strontium ferrite and barium ferrate contents were measured and investigated.
分析讨论锶铁氧体和钡铁氧体掺杂质量分数对压电复合材料压电性能、介电性能及声阻抗的影响。
3.
The effect of NiO content on dielectric properties of NiO/BaTiO3 composites was investigated.
以纳米NiO和BaTiO3粉为原料,在1100～1200℃烧结温度条件下,制备了NiO/BaTiO3陶瓷复合材料,研究了复合材料的介电性能。
5) dielectric constant
介电性能
1.
The effect of volume fraction of Si3N4 and particle size of the matrix on the thermal conductivity of the composite was investigated;the dielectric constant of the composite was evaluated.
研究了Si3N4含量和聚苯乙烯颗粒大小对复合材料导热性能和介电性能的影响,通过理论分析确定了影响导热性能的主要因素。
2.
The effect of volume fraction of Si_3N_4 on the thermal conductivity of the composite was investigated and the dielectric constant of the composite was evaluated.
研究了Si_3N_4含量对复合材料导热性能和介电性能的影响。
3.
The bendingstrength and dielectric properties, including dielectric constant and loss tangent, were investigated.
讨论了CZP陶瓷的抗弯强度及介电性能(包括介电常数和介质损耗)与工艺参数间的影响关系,并用扫描电镜对陶瓷断面进行观察。
6) dielectrical property
介电性能
1.
Influence of temperature and boiling time on the dielectrical property of glass fiber (before and after the glass fiber is treated with five kinds of coupling agents) / epoxy resin matrix composite interface was studied.
研究了温度和水煮时间对五种偶联剂处理前后的玻璃纤维／环氧树脂基复合材料界面层介电性能的影响。
2.
Influence of five kinds of coupling agents on the wetting property of glass fiber and on the dielectrical property of glass fiber / epoxy composite interface was studied.
本文研究了五种偶联剂对玻璃纤维浸润性能和玻璃纤维／环氧基复合材料界面介电性能的影响。
补充资料：虿介
1.见"虿芥"。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条