1) Cu film
铜膜
1.
Through the selective electroless deposition the Cu film pattern was obtained.
组装于硅片或玻璃片基片上的重氮树脂(DR)单层膜,吸附Sncl2,Pd催化剂后,通过无电沉积的方法,在这些基片上制备了铜膜。
2) Copper film
铜膜
1.
Influence of substrate structure on electromagnetic shielding effectiveness of copper film prepared by magnetron sputtering
基底结构对磁控溅射铜膜电磁屏蔽效能的影响
2.
It is less complicated to make a simple material structure by the combination of IBED transition layer and EBD copper film than to make a multi layer Ti Cu film by EBD.
采用离子束增强沉积 (IBED)铜过渡层和电子束蒸镀铜膜结合制备的单质膜结构 ,比采用电子束蒸镀钛 铜多层膜结构工艺简单 ,且不增加光刻腐蚀工艺难度 ,铜膜沉积于低表面粗糙度 (Ry≤ 0 。
3.
Molecular dynamics/statics study of the atom process and relevant energy for formation of the twins in (111) grown copper films have been carried out.
运用分子动力学和静力学方法对(111)生长铜膜中孪晶形成的原子过程与能量进行了模拟研究。
3) copper films
铜膜
1.
Stress as a function of temperature and isothermal relaxation in copper films on silicon substrates;
硅基铜膜应力随温度的变化及等温松弛
2.
The stress variation with temperature and thickness in copper films deposited onto silicon wafers are studied.
采用光学方法,测量了硅基镀铜膜的应力随厚度及温度变化关系。
3.
Compared with Aluminum,Copper films have higher conductivity and electromigration resitance,and will be substituted for aluminum so that copper films can be used as interconnected line and ground line,the residual stresses and conducticity of the thin films are two important parameters.
与铝相比铜膜具有电导率高，抗电迁移能力大而代替铝膜作为集成电路的内连线和地线，其残余应力和电导率是两个重要的参数。
4) nanocrystalline Cu film
纳米铜膜
1.
Electroless plating nanocrystalline Cu film on glass substrate;
玻璃表面化学镀纳米铜膜
5) extra-thin copper film
超薄铜膜
1.
The extra-thin copper film wrapped diamond nanoparticles were prepared by using electroless plating method under the condition of tin chloride sensitization and palladium chloride activation.
在氯化亚锡敏化、氯化钯活化的条件下 ,通过化学镀方法 ,成功地在纳米金刚石粉体表面制备了超薄铜膜 。
6) copper thin films
铜薄膜
1.
Enhanced Chemical Vapor-deposited Copper Thin Films on Self-assembled Monolayers and Related Simulations;
自组装单分子层改性硅基材上化学气相沉积铜薄膜及计算机模拟研究
补充资料：覆铜膜
分子式：
CAS号：
性质： 由聚酯、聚酰亚胺、聚四氟乙烯、聚苯醚等塑料薄膜与铜箔用胶黏剂胶接层压而成的复合膜。常用的胶粘剂有丙烯酸酯、环氧-丁腈、环氧-聚氨酯等胶粘剂。主要用于制造软性印刷线路板、软性印刷电缆及大型平板电容器等。
CAS号：
性质： 由聚酯、聚酰亚胺、聚四氟乙烯、聚苯醚等塑料薄膜与铜箔用胶黏剂胶接层压而成的复合膜。常用的胶粘剂有丙烯酸酯、环氧-丁腈、环氧-聚氨酯等胶粘剂。主要用于制造软性印刷线路板、软性印刷电缆及大型平板电容器等。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条