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1)  temperature cycling test
温度循环实验
2)  temperature cycle test
温度循环试验
3)  experiment by turns
循环实验
1.
Method and effect analysis of "experiment by turns"
“循环实验”模式及效果分析
4)  circulating temperature
循环温度
1.
Drilling fluid circulating temperature plays a very important role in predicting the equivalent circulating density of drilling fluids and in determining safe density windows.
钻井液循环温度是预测钻井液循环当量密度、确定钻井安全密度窗口的重要影响因素之一。
2.
Bottom-hole circulating temperature not only directly impacting rheological properties,density and chemical stability of drilling fluid,etc.
井下循环温度不但直接影响钻井液的流变性、密度及化学稳定性等,而且与井内压力平衡、循环压耗、套管和钻柱强度设计等有关,因此准确确定钻井作业时井内循环温度的分布和变化规律对钻井循环压耗、井控和安全快速钻进具有极其重要的意义。
3.
It is important for the drilling and completion to learn about accurate distribution of circulating temperature in the wellbore.
准确的井下循环温度对钻井与完井工程十分重要。
5)  thermal cycle
温度循环
1.
This paper introduces techniques problems in the ultrasonic bonding of thick film spun gold and gold conductor,and tests the bonding performance of spun gold and gold conductor with the methods of the ruinous pull test and the thermal cycle test after indoor and environment tests.
介绍了厚膜金丝与金导体超声键合遇到的工艺问题,并用破坏性拉力和温度循环试验方法,分别在室温和其它环境下试验后,测试金丝与金导体超声键合的性能。
2.
In order to accomplish the environment stress screen of space borne infrared detectors and study the failure mechanism dur-ing the course of thermal cycle,the thermal cycle system,based on singlechip is introduced in this paper.
由于航天工程的需要,为了对航天用红外探测器进行环境应力筛选并研究器件在高低温循环过程中的失效机理,本文提出了一种基于单片机控制的温度循环试验自动控制系统。
3.
Thus such cryogenic semiconductor components as HgCdTe mid or long wavelength infrared(IR) detectors are subjected to thousands of repeated thermal cycles from below-173℃ to room temperature.
在某些情况下斯特林制冷机采用间歇式工作方式,以延长卫星在太空中的服务年限,因此由斯特林机致冷的低温半导体器件如HgCdTe中长波红外探测器会经受成千上万次从-173℃以下到常温的温度循环,这个过程可能会造成器件的失效。
6)  temperature cycle
温度循环
1.
A control circuit for presetting,displaying,counting welding temperature cycles and automatically switching;
焊接温度循环次数预置、显示、计数及自动通断电控制电路
2.
Distribution of equivalent stress and plastic strain for solder joints array under temperature cycle was studied and located the maximum stress and strain solder joints respectively;The dynamic curve of equivalent stress and plastic strai.
以Aand统一粘塑性本构方程描述无铅焊点的粘塑性行为,研究了在温度循环载荷下焊点阵列等效应力和塑性应变的分布规律,找出了实体模型中最大应力和应变的焊点位置;分析了最大应变焊点的等效应力周期性变化和等效塑性应变累积的动特性曲线;基于Manson-Coffin焊点疲劳寿命模型,对关键焊点进行了寿命预测,疲劳寿命值为3。
3.
The stability of CdS/CdTe solar cells is investigated at the temperature cycles.
 对CdS/CdTe太阳电池在温度循环下的稳定性进行了研究,测定了其I V特性曲线,并与室温下的电池作了比较。
补充资料:保险商实验室安全标准(见保险商实验室)


保险商实验室安全标准(见保险商实验室)
safety standards of UL: see Underwriters Laboratories; UL

  Baoxianshang Sh啊nshi anquan bicozhun保险商实验室安全标准(saJ七ty stand助dsofUL)见保险商实脸室。
  
说明:补充资料仅用于学习参考,请勿用于其它任何用途。
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