1) thermal conducting mechanism
导热机理
1.
Typical theory model and thermal conducting mechanism of filled thermal conductive rubber were summarized,and the research and development status of thermal conductive systems filled with single filler and multi-fillers in the world were reviewed with 29 references,and developing prospects for thermal conductive rubber were also pointed out.
综述了填充型导热橡胶的典型理论模型和导热机理,介绍了单组分导热填料填充体系和多组分导热填料填充体系的国内外研究开发状况,指出了今后导热橡胶的开发方向。
2.
In this paper,the thermal conducting mechanism and models of thermal conductive adhesive were described,and the approaches of improving thermal conducting were also discussed.
综述了导热胶粘剂的导热机理、导热模型以及提高胶粘剂导热性能的途径；详细介绍了非绝缘导热胶粘剂和绝缘导热胶粘剂的技术研究与应用,最后对导热胶粘剂的发展前景作了展望。
3.
The thermal conducting mechanism and thermal conducting models were also described.
介绍了导热绝缘聚合物复合材料,包括复合型塑料、橡胶、胶粘剂和涂层的研究进展及其导热机理、导热模型的研究情况。
2) heat conduction mechanism
导热机理
1.
Based on the following four principles—micro-dimension effects, heat diffusion from Brownian motion, solid-liquid micro interface and particle clustering structure, the heat conduction mechanism in nanofluids was studied.
从颗粒小尺寸效应、布朗运动引起的微对流、固液吸附微界面和颗粒聚集结构上分析了纳米流体导热机理,并推导了适合纳米流体的热导率预测公式。
2.
The heat conduction mechanism is analyzed inthis paper in terms of sound quantun and photon heat conduction and macroscopic thermal properties.
本文从声子导热、光子导热和宏观热学性质三个方面分析了漂珠轻质砖的导热机理。
3) thermal conduction mechanism
导热机理
1.
This article reviews new progress of A1N in the field of thermal conduction mechanism,and preparation of the A1N powder and A1N film.
本文综述了近年来A1N在导热机理、粉末其及薄膜制备等领域的研究进展,展望了A1N未来的发展趋势。
2.
This article reviews in detail new progress of AlN in the fild of defects,thermal conduction mechanism,processing of powder and its hydrolysis and oxidation,and sintering at present.
本文详细地综述了近年来AlN陶瓷在晶体缺陷、导热机理、粉末的制备及其水解和氧化、烧结及其应用等领域的研究进展 ,并展望了AlN未来的发展趋势。
3.
This paper describes in detail new progress abroad and at home and thermal conduction mechanism,introduces and analyzes technological process and influencing factors for A1N package preparation,sums up progress in-metalization and sintering technology,and finally suggests the development trend of AlN.
详细综述了AlN板的国内外研究现状及其导热机理;介绍并分析了基片制备的工艺流程和影响因素;概括总结了AlN基板的金属化和烧结工艺方面的研究进展;展望了AlN基板的发展趋势和前景。
4) thermal mechanism
导热机理
1.
On the basis of the experimental investigation and theoretical analyses,thermal mechanism and the effect of microstructure of pyrocarbon on thermal conductivity of C/C composite were studied.
通过调节丙烯与氢气的比例得到热解炭结构分别为粗糙层(RL),光滑层(SL),各向同性(ISO)的三种C/C复合材料,研究了热解炭组织结构对C/C复合材料热导率的影响,讨论了C/C复合材料的导热机理。
5) heat conduction mechanism
热传导机理
1.
In order to know further about temperature distribution in wellbore of dual tubing production with sub heat tracing in developing thick oil reservoirs,this paper studies the alternation of temperature and pressure in the main wellbore s fluid by using heat conduction mechanism.
为了进一步了解采用双管拌热技术开采稠油油藏时的井筒温度分布情况,利用井筒热传导机理研究了主管内流体温度和压力的变化情况。
6) conduction-evaporation mechanism
导热-蒸化机理
补充资料：导电导热胶粘剂
分子式：
分子量：
CAS号：
性质：能起导电或（和）导热作用的胶粘剂。胶粘剂一般是绝缘性的，可加入银粉、炭黑等使之发生传导作用。常用的树脂有：环氧树脂、丙烯酸系树脂、酚醛树脂和聚氨酯等。用于电子管的真空导电密封、波导元件和印刷电路板的制造和修补、半导体收音机的安装以及电子计算机插件中线路等的粘合和修补等。
分子量：
CAS号：
性质：能起导电或（和）导热作用的胶粘剂。胶粘剂一般是绝缘性的，可加入银粉、炭黑等使之发生传导作用。常用的树脂有：环氧树脂、丙烯酸系树脂、酚醛树脂和聚氨酯等。用于电子管的真空导电密封、波导元件和印刷电路板的制造和修补、半导体收音机的安装以及电子计算机插件中线路等的粘合和修补等。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条