Drilling fluid circulating temperature plays a very important role in predicting the equivalent circulating density of drilling fluids and in determining safe density windows.

Bottom-hole circulating temperature not only directly impacting rheological properties,density and chemical stability of drilling fluid,etc.

It is important for the drilling and completion to learn about accurate distribution of circulating temperature in the wellbore.

This paper introduces techniques problems in the ultrasonic bonding of thick film spun gold and gold conductor,and tests the bonding performance of spun gold and gold conductor with the methods of the ruinous pull test and the thermal cycle test after indoor and environment tests.

In order to accomplish the environment stress screen of space borne infrared detectors and study the failure mechanism dur-ing the course of thermal cycle,the thermal cycle system,based on singlechip is introduced in this paper.

Thus such cryogenic semiconductor components as HgCdTe mid or long wavelength infrared(IR) detectors are subjected to thousands of repeated thermal cycles from below-173℃ to room temperature.

A control circuit for presetting,displaying,counting welding temperature cycles and automatically switching;

Distribution of equivalent stress and plastic strain for solder joints array under temperature cycle was studied and located the maximum stress and strain solder joints respectively;The dynamic curve of equivalent stress and plastic strai.

The stability of CdS/CdTe solar cells is investigated at the temperature cycles.

This article analyses the changing of some performance parameters of modern building curtain walls of some plaza in Chongqing city, by proceeding the tests of air permeability performance, water-tightness performance, wind resistance performance, performance in plane deformation, and high-low temperature cycles.

In this paper, our recent results on temperature cycling experiment in the systems consisting electron donor, acceptor and polymer host were reported.

According to the results of internal temperature change measurement during temperature cycling for the electronic device of missile, the influence of the temperature alteration ratio on screening degree and cycling times is discussed, and the functions of increasing temperature alteration ratio in the process of temperature cycling are expounded.

The thermal fatigue failure of SnPb solder joints of flip chip on board with and without underfill is investigated for two types of flip chip packages by conducting thermal cycling tests,C SAM observations and cross section inspections.