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1)  RF sputtering
射频溅射
1.
Influence of target self-bias in inverted cylindrical RF sputtering on the microstructure and electrical properties of Ba_(0.65)Sr_(0.35)TiO_3 thin films;
倒筒式射频溅射自偏压对Ba_(0.65)Sr_(0.35)TiO_3热释电薄膜结构及性能的影响
2.
Study of 3C-SiC and 4H-SiC films deposited using RF sputtering method;
射频溅射法制备3C-SiC和4H-SiC薄膜
3.
Nanocrystalline TiO_2 thin films were prepared by reactive RF sputtering, then the samples were treated by Ar radio frequency plasma.
用反应射频溅射法在导电玻璃上制备TiO2薄膜,并用Ar射频等离子体对TiO2薄膜进行处理。
2)  radio frequency sputtering
射频溅射
1.
Preparation of cubic boron nitride films by radio frequency sputtering;
射频溅射法制备立方氮化硼薄膜
3)  RF sputter
射频溅射
1.
Y 2O 2S∶Eu cathodoluminescent thin films have been grown on yttrium aluminum garnet substrates by RF sputtering with sintered Y 2O 2S∶Eu phosphor as a target.
在钇铝石榴石单晶基片上用射频溅射法制取了Y2 O2 S∶Eu红色发光薄膜。
2.
ZnS·Ag cathodoluminescent thin films have been grown on yttrium aluminum garnet substrates by RF sputtering with sintered ZnS·Ag phosphor as a target.
用烧结ZnS·Ag蓝色荧光粉靶在钇铝柘榴石单晶基片上射频溅射制取了ZnS·Ag蓝色发光薄膜。
3.
The c\|BN thin films were deposited on different substrates with hot\|filament\|assisted plasma CVD and RF sputter.
还用13 5 6MHz的射频溅射系统将c BN薄膜沉积在Si衬底上 ,靶材为h BN(纯度 99 99% ) ,溅射气体为氩气和氮气的混合气体 ,所得到的氮化硼薄膜中立方相含量高于 90 % 。
4)  RF magnetron sputtering
射频溅射
1.
Methods SiC films were prepared on glass substrates by RF magnetron sputtering and then annealed in a vacuum annealing system.
方法用射频溅射法在玻璃衬底上制备SiC薄膜,退火处理后并利用光致发光谱(PL)对发光性能进行分析。
5)  mid-frequency sputtering
中频溅射
6)  HF sputtering
高频溅射
补充资料:射频溅射
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性质:利用射频放电产生的离子轰击靶材进行溅射的镀膜技术。射频溅射装置主要由真空室、真空系统和射频溅射电源构成。溅射出来的靶材原子沉积在工件上形成镀层,射频溅射电源的频率规定为13.56MHz。在相同靶功率密度和工作气体压强的条件下,射频溅射的镀膜速率与直流溅射相近。其特点是可采用绝缘材料作靶,镀制陶瓷和高分子膜。由于射频溅射的镀膜速度低,并且射频辐射对人体有害,因而限制了它的广泛应用。

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