1) oxygen-free copper
无氧铜
1.
Brazing between high purity alumina ceramic and oxygen-free copper;
高纯氧化铝陶瓷与无氧铜的钎焊
2.
A novel technology of electromagnetic deoxidization (EMD) & electromagnetic continuous casting (EMC) for quality oxygen-free copper (OFC) processing was presented and industrial experiments and the production of OFC with this technology were completed.
提出一种在国内企业现有装备基础上生产高性能无氧铜的电磁脱氧-电磁连铸的方法,并完成工业试验和批量生产。
3.
Inconnectionwiththe technological characteristics ofthe productionofoxygen-free copper,factors whichinfluence the quality of oxygen-free copper are analysed,including:the productive methods,original and auxi-material,technologies for smelting and casting and inspectional methods.
针对无氧铜生产的工艺特点 ,分析了原辅材料、熔铸工艺及检测方法等对无氧铜产品质量的影响 ,并结合国内无氧铜生产现状 ,提出了保证和稳定无氧铜产品质量的控制措施。
2) oxygen free copper
无氧铜
1.
Gas Hole Characteristics and Forming Mechanism of Oxygen Free Copper Rod with Up Casting;
上引铸造无氧铜杆的气孔特征及其形成机理
2.
This paper introduces the qualities and applications of oxygen free copper,analyzes its production technology together with its main factors influencing its quality,points out the measures for controlling the quality and studies the means for eliminating the sources of oxygen.
介绍了无氧铜的性能和用途,分析了无氧铜生产的工艺,以及影响无氧铜质量的主要因素,提出了控制无氧铜质量的措施,尤其是在排除氧的来源方面作了研究。
3.
Effect of trace Ag on the properties of oxygen free copper was studied.
1% )对无氧铜性能的影响 ,结果表明 :经Ag强化的无氧铜银合金 ,在电导率下降甚少的情况下 ,显著提高了抗拉强度、硬度和软化温度。
3) OFHC copper
无氧铜
1.
The determination of nitride and oxide contents of OFHC copper and Cu Cr alloy are described especially.
介绍了TC 4 36N/O测定仪的结构、原理及其在真空电子材料中的应用 ,着重对无氧铜、Cr Cu合金中的N ,O气体含量测定 ,作了较多的论述。
2.
The dynamic release behavior of OFHC copper under 10~20 GPa shock pressure was simulated by using the Johnson-Cook(JC) constitutive model and Steinberg-Cochran-Guinan(SCG) constitutive model,respectively.
分别利用Johnson-Cook(JC)本构模型和Steinberg-Cochran-Guinan(SCG)本构模型对无氧铜在10~20 GPa冲击压力下的卸载过程进行了数值模拟,与冲击-卸载实验结果比较表明,在这样的冲击压力下无氧铜的应变率效应仍然明显,JC模型对无氧铜的动态卸载行为有较好的描述。
3.
The determination of nitride and oxide contents of OFHC copper and Cu-Cr alloy are described especially.
介绍了TC-436 N/O测定仪的结构、原理及其在真空电子材料中的应用,着重对无氧铜、Cr-Cu合金中的N,O气体含量测定,作了较多的论述。
4) Oxygen Free Copper Rod
无氧铜杆
1.
Effects of RE on Technological Processing and Product Properties of Oxygen Free Copper Rod;
稀土对无氧铜杆生产工艺及产品性能的影响
5) zirconium oxygen-free copper
锆无氧铜
1.
Research on forming process of zirconium oxygen-free copper alloy applied to shrink ratio power chamber;
缩比动力室用锆无氧铜材料的成型工艺研究
6) coalesced copper,oxygen-free copper
无氧铜<冶>
补充资料：无氧铜
分子式：
CAS号：
性质：不含氧也不含任何脱氧剂残留物的纯铜。但实际上还是含有非常微量氧和一些杂质。按标准规定，氧的含量不大于0.03％，杂质总含量不大于0.05％，铜的纯度大于99.95％。根据含氧量和杂质含量，无氧铜又分为一号和二号无氧铜。一号无氧铜纯度达到99.97％，氧含量不大于0.003％，杂质总含量不大于0.03％；二号无氧铜纯度达到99.95％，氧含量不大于0.003％，杂质总含量不大于0.05％。无氧铜无氢脆现象，导电率高，加工性能和焊接性能、耐蚀性能和低温性能均好。
CAS号：
性质：不含氧也不含任何脱氧剂残留物的纯铜。但实际上还是含有非常微量氧和一些杂质。按标准规定，氧的含量不大于0.03％，杂质总含量不大于0.05％，铜的纯度大于99.95％。根据含氧量和杂质含量，无氧铜又分为一号和二号无氧铜。一号无氧铜纯度达到99.97％，氧含量不大于0.003％，杂质总含量不大于0.03％；二号无氧铜纯度达到99.95％，氧含量不大于0.003％，杂质总含量不大于0.05％。无氧铜无氢脆现象，导电率高，加工性能和焊接性能、耐蚀性能和低温性能均好。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条