1) lead frame materials
引线框架材料
1.
With the development of IC to high density?miniaturization?low cost, the count of I/O increased, lead pitch decreased, which demand high strength?high conductivity for lead frame materials.
引线框架材料是半导体元器件和集成电路封装的主要材料之一，其主要功能为电路连接、散热、机械支撑等。
2.
The Effect of lead frame materials on interface microstructure between copper alloys and SnPb solder was investigated by means of optical microscope and scanning electron microscope (SEM) equipped with energy dispersive X-ray spectroscopy.
结果表明,引线框架材料对铜合金与SnPb共晶焊料界面组织有很大的影响,焊点在160℃高温老化300 h后,CuCrZr系合金和CuNiSi合金与SnPb的界面金属间化合物为Cu6Sn5,其厚度在5~10 mm; 而C194合金与SnPb的界面金属间化合物为分布有Pb颗粒的Cu6Sn5,厚度已高达60~70 mm,同时还发现有微小空洞存在,影响焊点的可靠性。
2) lead frame material
引线框架材料
1.
The current status of research on lead frame materials used in integrated circuit is summarized in this paper.
概述了目前集成电路用引线框架材料的一些研究进展,包括引线框架的功能、制备工艺、成分设计及其对材料的性能要求等,重点介绍了铜基引线框架材料的特性和研发动态,最后,提出了今后引线框架材料的研究方向。
2.
KFC copper alloy is one of the representative lead frame materials with good electric conductivity.
KFC合金是具有代表性的高导电引线框架材料之一。
3.
Lead frame materials play a very important role in IC.
引线框架材料在集成电路中起着固定芯片,保护内部元件,传递电信号并向外部散发热量的作用,是基础电路的关键部件,而作为引线框架材料用Cu-Cr-Zr合金,由于其能通过合理的形变热处理工艺改善组织、性能而获得高强高导性能,从而成为最具发展潜力的高性能铜合金材料。
3) leadframe materials
引线框架材料
1.
With the development of IC to high density,multifunction and miniaturization,the amount of lead increase,and lead pitch space decreases,which demand high strength and excellent punchability for leadframe materials.
随着集成电路向高集成度、多功能化和小型化方向发展,其引线数增多、引线间距减小,因此对引线框架材料的强度和冲裁加工性能提出了更高的要求。
4) C194 alloy for lead frame
C194引线框架材料
1.
Every step of the process for producing C194 alloy for lead frame is studied and analyzed with the result that suggestions and references for producing high quality C194 alloy for lead frame are provided.
对C194引线框架材料各个生产工序的生产工艺进行了分析和探讨,为生产出高质量的引线框架材料提供了有利的建议和参考。
5) lead frame
引线框架
1.
Study on heat treatment process of C194 copper alloy for lead frame;
引线框架用铜合金C194热处理工艺研究
2.
Development of Cu-Ni-Si alloy for lead frame;
引线框架用Cu-Ni-Si合金的发展
3.
Microstructure and properties of Cu-Ni-Si based alloys for lead frame;
Cu-Ni-Si基引线框架合金的组织和性能
6) Leadframe
引线框架
1.
When the leadframe made of 4J42 alloy is brazed to the brazing zone of an alumina substrate using an AgCu28 filler in ceramic DIP production, the liquid filler often flows onto the surface of the leadframe after brazing, and the quality of finished products is influenced greatly.
陶瓷DIP外壳需要使用AgCu28钎料将4J42合金引线框架与陶瓷基板的焊区钎焊在一起,焊后易出现钎料在引线框架上流淌的问题,影响产品的质量。
2.
Inthispaper,themicrostructuresandtheirchangesinhightemperatureoftheinterfacesbetweenfourcivilcopperalloysforleadframeandSn -Pbsolderalloysarestudied .
研究了四种国产引线框架用铜合金与Sn -Pb共晶焊料的界面结构及其在高温保温过程中的变化。
3.
It was discussed the leadframe driving structure moving along line intermittently, especially the principle of the 3D cam in the designed die bonder.
讨论了IC芯片粘片机的引线框架直线间歇式供送机构和空间凸轮的工作原理。
补充资料：引线
1.见"引线"。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条