Using epoxy-acrylate prepolymer,maleimide resin and aluminium silicate as the heat resistant ingredients of adhesive,the paper studied the effects of the ingredients on the heat resistance of acrylate structural adhesive.

The thermal stability of the new polymaleimide resin bas been studied by TG method.

Progress of bismaleimide resin used for PCB laminate;

Research progress of bismaleimide resin modified by allyl compounds

The basic principle of the toughening and modifying on bismaleimide resin was introduced, the characteristics and the modifying effects of the toughening and modifying with thermoplastic resin, the combination of aromatic diamine and epoxy resin, organic silicone, allyl compounds, cyanate ester resin, the blends of three-dimensional braided carbon and Kevlar fabrics and so on were discussed.

The gelation process of BMI resin system was investigated by gelation disk,and the relationship between gel-time vs temperature was obtained.

Effects of BMI/DBA ratio on morphologies of BMI/DBA/PEI blends and on diameters and distributions of BMI resin microspheres were studied in this paper.

BMI Resin System and Affordable Composite;

Quartz fibre strengthen Bis maleimide BMI composite material have low to dielectric loss angle, able to bear high temperature, damp and hot, good mechanics performance.

The cure kinetic model and kinetic parameters of BMI resin for RTM are studied by DSC.

Study on dissolubility modification of bismaleimide resin/diamine;

Research on Bismaleimide Molecular Composites;

This paper introduces the synthesis processes of bismaleimide(BMI),especially modification methods of BMI are reviewed.

The cure kinetic model of typical BMI resin was studied, and the typical BMI resin has been obtained by copolymerization of bis (4-maleimido-phenyl)methat and o,o-diallylbisphenol-A.