1) molybdenum-copper composite
Mo-Cu材料
1.
The morphology and mechanical alloying extent of the molybdenum-copper composite powder and metallurgical structure of the sintered composite were analyzed by means of SEM,TEM and XRD.
通过扫描电镜、透射电镜及X射线衍射等对Mo-Cu复合粉末的粉末形貌、合金化程度及烧结后合金组织结构进行分析,研究了高能球磨后Mo-Cu材料的显微组织及其与陶瓷热膨胀性能匹配的关系。
2) Mo/Cu
Mo/Cu复合材料
1.
55% , 60% and 67% Mo/Cu composites for electronic packaging applications were fabricated using patent-squeeze casting technology.
5%,Mo的体积分数分别为55%,60%,67%三种Mo/Cu复合材料,并对其进行了组织观察,结果表明:Mo/cu复合材料组织均匀,没有明显的孔洞和缺陷。
3) waste Mo-Cu alloy
Mo-Cu合金废料
1.
A technic that reclaims molybdenum and copper from waste Mo-Cu alloy plates with nitric acid disposal has been explored.
用硝酸溶解Mo-Cu合金废料,回收金属钼和硝酸铜。
4) W/Cu material
W/Cu材料
5) Cu/Ti_3AlC_2
Cu/Ti_3AlC_2材料
6) W-Cu materials
W-Cu材料
1.
In order to obtain W-Cu materials in high-grade, the process such as vacuum hot-pressing or HIP is usually used to increase the relative density.
为了获得具有优良性能的高档W-Cu材料,一般还要采用真空热压或热等静压。
补充资料：材料界面(见材料表面)
材料界面(见材料表面)
interface of materials
材料界面interfaee of materials见材料表面。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条