化学镀Ni-Co-W-P,electroless Ni-Co-W-P plating,音标,读音,翻译,英文例句,英语词典

您的位置：首页 -> 词典 -> 化学镀Ni-Co-W-P

1) electroless Ni-Co-W-P plating 点击朗读

化学镀Ni-Co-W-P

In order to improve the deposition rate, anti - corrosion properties and high hydrogen overpotential of electroless Ni-Co-W-P plating, the effects of the composition, pH value, temperature, rotation speed and surface active agents were respectively studied on the deposition rate and corrosion resistance of electroless Ni-Co-W-P coating.

为改善化学镀Ni-Co-W-P合金工艺镀速慢、镀层耐腐蚀性能差、析氢过电位高等问题,研究了镀液组分、pH值、温度、转速、表面活性剂对45钢上化学镀Ni-Co-W-P合金镀层沉积速度、耐腐蚀性能、镀层厚度、孔蚀率、表面形貌和硬度的影响,得出最佳镀液配方:6g/LCoSO4,24g/LNiSO4,20g/LNaH2PO2,20g/LNa2WO4·2H2O,20g/L(NH4)2SO4,24g/LNa3C6H5O7,11g/L苹果酸,pH值7。

2) electroless plating Ni-W-Mo-P 点击朗读

化学镀Ni-W-Mo-P

Effects of Na2WO4 concentration,pH value,temperature and time on the deposition rate,hardness,porosity corrosion resistance and corrosion potential of electroless plating Ni-W-Mo-P,were studied so as to improve the deposition rate,hardness and anti-corrosion properties of electroless plating Ni-W-Mo-P respectively.

为了获得四元化学镀Ni-W-Mo-P合金的高镀速、高硬度和高耐腐蚀性,以三元化学镀Ni-Mo-P的镀液配方为基础,研究了钨酸钠浓度、pH、施镀温度、时间对Ni-W-Mo-P合金镀层沉积速度、硬度、孔隙率、耐蚀性、腐蚀电位的影响,得出最佳化学镀工艺:30～40g/L钨酸钠;pH 9;85～90℃;1。

3) Co-Ni-P electroless plating 点击朗读

化学镀Co-Ni-P

例句>>

4) Ni-P/Ni-W-P double-coating 点击朗读

Ni-P/Ni-W-P双层化学镀

5) Electroless Ni-W-P coating 点击朗读

化学镀Ni-W-P镀层

6) Electroless Ni-W-P alloy coating 点击朗读

化学镀Ni-W-P合金镀层

Electroless Ni-W-P alloy coating with strong corrosion resistance and high hardness has a wide range of applications and is easy to form amorphous structure.

化学镀Ni-W-P合金镀层易形成非晶态结构,具有较强的耐腐蚀性及较高的硬度,应用范围十分广泛。

补充资料：镀覆用化学品

分子式：
CAS号：

性质：在印制电路板生产中涉及到化学镀铜、电镀铜、电镀锡/铅、电镀金、电镀镍等许多镀覆工艺。在基板上镀覆金属镀层主要有以下作用：(1)在通孔上进行化学镀以使双面板正反面相连或使多层板各层相连；(2)电镀通孔或在板上电镀电路图形；(3)在电路上镀保护层以防其氧化并作为下道腐蚀工序的抗蚀镀层；(4)在印制板上镀覆接触键(插头座)。另外，在集成电路和电子元器件生产制造过程中也涉及许多镀覆工艺。镀覆化学品系指上述镀覆工艺使用的一系列化学镀液和化合物。化学镀液的技术性、专用性、配套性很强，同一类镀液各公司的配方不尽相同，镀液性能及其使用工艺对镀层的质量有很大影响。

说明：补充资料仅用于学习参考，请勿用于其它任何用途。

参考词条

化学镀Ni-Co-P合金化学镀Ni-P Ni-P化学镀化学镀Ni–P Ni-W-P镀层化学镀Ni-P镀液 Ni-Co-P镀层化学镀Co-Ni-B

Ni-Co-W-P 化学镀Ni-W-P合金

说明：双击或选中下面任意单词，将显示该词的音标、读音、翻译等；选中中文或多个词，将显示翻译。
	您的位置：首页 -> 词典 -> 化学镀Ni-Co-W-P 1) electroless Ni-Co-W-P plating 化学镀Ni-Co-W-P 1. In order to improve the deposition rate, anti - corrosion properties and high hydrogen overpotential of electroless Ni-Co-W-P plating, the effects of the composition, pH value, temperature, rotation speed and surface active agents were respectively studied on the deposition rate and corrosion resistance of electroless Ni-Co-W-P coating. 为改善化学镀Ni-Co-W-P合金工艺镀速慢、镀层耐腐蚀性能差、析氢过电位高等问题,研究了镀液组分、pH值、温度、转速、表面活性剂对45钢上化学镀Ni-Co-W-P合金镀层沉积速度、耐腐蚀性能、镀层厚度、孔蚀率、表面形貌和硬度的影响,得出最佳镀液配方:6g/LCoSO4,24g/LNiSO4,20g/LNaH2PO2,20g/LNa2WO4·2H2O,20g/L(NH4)2SO4,24g/LNa3C6H5O7,11g/L苹果酸,pH值7。 2) electroless plating Ni-W-Mo-P 化学镀Ni-W-Mo-P 1. Effects of Na2WO4 concentration,pH value,temperature and time on the deposition rate,hardness,porosity corrosion resistance and corrosion potential of electroless plating Ni-W-Mo-P,were studied so as to improve the deposition rate,hardness and anti-corrosion properties of electroless plating Ni-W-Mo-P respectively. 为了获得四元化学镀Ni-W-Mo-P合金的高镀速、高硬度和高耐腐蚀性,以三元化学镀Ni-Mo-P的镀液配方为基础,研究了钨酸钠浓度、pH、施镀温度、时间对Ni-W-Mo-P合金镀层沉积速度、硬度、孔隙率、耐蚀性、腐蚀电位的影响,得出最佳化学镀工艺:30～40g/L钨酸钠;pH 9;85～90℃;1。 3) Co-Ni-P electroless plating 化学镀Co-Ni-P 例句>> 4) Ni-P/Ni-W-P double-coating Ni-P/Ni-W-P双层化学镀 5) Electroless Ni-W-P coating 化学镀Ni-W-P镀层 6) Electroless Ni-W-P alloy coating 化学镀Ni-W-P合金镀层 1. Electroless Ni-W-P alloy coating with strong corrosion resistance and high hardness has a wide range of applications and is easy to form amorphous structure. 化学镀Ni-W-P合金镀层易形成非晶态结构,具有较强的耐腐蚀性及较高的硬度,应用范围十分广泛。补充资料：镀覆用化学品分子式： CAS号：性质：在印制电路板生产中涉及到化学镀铜、电镀铜、电镀锡/铅、电镀金、电镀镍等许多镀覆工艺。在基板上镀覆金属镀层主要有以下作用：(1)在通孔上进行化学镀以使双面板正反面相连或使多层板各层相连；(2)电镀通孔或在板上电镀电路图形；(3)在电路上镀保护层以防其氧化并作为下道腐蚀工序的抗蚀镀层；(4)在印制板上镀覆接触键(插头座)。另外，在集成电路和电子元器件生产制造过程中也涉及许多镀覆工艺。镀覆化学品系指上述镀覆工艺使用的一系列化学镀液和化合物。化学镀液的技术性、专用性、配套性很强，同一类镀液各公司的配方不尽相同，镀液性能及其使用工艺对镀层的质量有很大影响。说明：补充资料仅用于学习参考，请勿用于其它任何用途。参考词条化学镀Ni-Co-P合金化学镀Ni-P Ni-P化学镀化学镀Ni–P Ni-W-P镀层化学镀Ni-P镀液 Ni-Co-P镀层化学镀Co-Ni-B

©2011 dictall.com