1)  SMT
SMT
1.
PROGRESS IN RESEARCH OF SMT SOLDER JOINT RELIABILITY DURING DROP IMPACT;
跌落碰撞下SMT焊点可靠性研究进展
2.
On Improving the Quality of SMT Soldering;
浅谈提高SMT焊接质量的策略
3.
Impact and Countermeasure of Silk-Screen Printing on SMT Quality;
丝网印刷对SMT质量的影响及对策
2)  SMT
表面贴装技术
1.
Significance of Application and Dissemination of SMT;
表面贴装技术（SMT）推广应用的优越性
2.
Application of Image Processing in SMT;
视觉辅助表面贴装技术中图像处理技术的研究
3.
The essay separately introduced request,realizing approaches and comparison on the pros and cons in accordance with the MES application in SMT.
针对MES在表面贴装技术(SMT)行业的应用,分别介绍了SMT车间数据采集的要求,实现的方法及其优劣比较。
3)  SMT
表面组装技术
1.
The solder alloys especially the lead-free solder alloys become the focus of study because of the quick development of the microelectronics and the surface mount technology (SMT).
随着微电子表面组装技术的迅猛发展 ,软钎料尤其是无铅钎料逐渐成为研究的焦点。
2.
The quality of solder joint affects the reliability of the products produced by SMT directly.
由表面组装技术(SMT)形成的产品,其焊点质量直接影响到产品的可靠性。
3.
The designing of bonding pads is the key in surface mount technology(SMT).
焊盘设计技术是表面组装技术(SMT)的关键。
4)  SMT
表面安装技术
1.
Surface Mount Technology has been developed quickly and got wide application in electronic indus-try since 1980, the article analyses the latest development of SMT equipment.
表面安装技术自80年代以来在电子工业中得到了广泛应用和发展。
2.
By using multiple fiber connectors,large core diameter fibers,window type optoelectronic components,and SMT technology,miniature optical fiber transmission is realized for transmitting the computer multi-channel signals.
光纤传输系统在计算机信号的防电磁干扰、防信息泄漏等方面具有重要作用,采用多芯光纤连接器、大芯径光纤、光窗型光电器件、表面安装技术(SMT)等实现了计算机中多路信号的小型化光纤传输,该系统达到了设计指标要求。
3.
By improving the fabrication process of element and introducing surface mountable technology(SMT),a novel SMT LD isolator with high performance was developed.
基于高斯光束耦合理论,对光斜面耦合的光隔离器回波损耗进行了分析,通过改进核心元件的加工组合工序,采用表面安装技术,研制了光斜面耦合的高性能表面安装型光隔离器,测试结果表明,这种表面安装光隔离器具有优异的性能参数。
5)  SMT
表面贴装
1.
It also introduces the lead-free printing paste appli-cable to SMT.
提出了无铅印料的配方及性能要求,说明了无铅印料在倒装芯片与表面贴装中的应用。
6)  SMT
表面组装（SMT）
补充资料：5-Mercapto-1,2,3,4-Tetrazole-1-Methyl Sulfonic Acid Di-sodium Salts (SMT-DS)
分子式：C2H2N4O3S2Na2
分子量：240.17
CAS号：66242-82-8

性质：白色晶体粉末。

制备方法：暂无

用途：医药中间体。

说明：补充资料仅用于学习参考，请勿用于其它任何用途。