1) Ti_2AlNb intermetallic compound
Ti2AlNb金属间化合物
2) Ti2AlNb-based alloy
Ti2AlNb基合金
1.
Microstructure and tribological properties of surface plasma chromising layer of Ti2AlNb-based alloy;
Ti2AlNb基合金表面渗铬层结构及其摩擦学性能
2.
The change of electron structures are calculated with the empirical electron theory of solid and molecule for Ti2AlNb-based alloy with different W occupations in Ti sublattice.
利用固体与分子经验电子理论计算了Ti2AlNb基合金中外来原子W的不同占位比引起基体电子结构的变化,分析了价电子结构参数nA,σ和ρ的变化及描述原子状态的特征参数nT,nc,nl的变化,讨论了W在不同占位比情况下的价电子结构对合金性能的影响。
3.
Melting characteristics of Ti2AlNb-based alloy are discussed.
讨论了Ti2AlNb基合金的熔炼特点,概括介绍了真空水冷铜坩埚感应凝壳熔炼的设备结构原理和工艺技术,结合Ti2AlNb基合金的熔炼实践,研究了合金元素的加入形式、熔炼室真空度对合金铸锭的均匀性以及合金中Al挥发烧损的影响规律。
3) Ti2AlNb
Ti2AlNb合金
1.
Ti2AlNb intermetallic alloys based on orthorhombic phase have excellent potential as advanced aerospace and elevated temperature structural materials because of their high specific strength and stiffness as well as their creep and oxidation resistance.
以O相为基础的Ti2AlNb合金具有高的比强度、比刚度以及良好的高温蠕变性能和抗氧化性能,已经成为最具潜力的航空航天高温结构材料。
4) Intermetallic Compound
金属间化合物
1.
Preparation of SbSn intermetallic compound with Al addition and desulfurization behavior for emulsion of crude oil;
金属间化合物SbSn的掺Al制备及原油乳液脱硫
2.
Status of intermetallic compound coatings synthesized by laser cladding;
激光熔覆在金属间化合物涂层材料制备中的应用
3.
Preparation,characterization and viscosity reduction for crude oil of single-phase SbSn intermetallic compound;
单相金属间化合物SbSn的制备、表征及其对原油降黏
5) IMC
金属间化合物
1.
Effect of the IMC in Sn-Ag-Cu Solders on Soldering Properties;
Sn-Ag-Cu焊料中金属间化合物对焊接性能的影响
2.
The Effects of High Magnetic Field on the Growth Behaviors of Tin-copper Intermetallic Compounds (IMC) Layers;
强磁场对锡铜金属间化合物生长行为的研究
3.
Growth behavior of intermetallic compounds (IMC) at SnAgCu/Cu interfaces under two kinds of thermal cycling and thermal aging condition was investigated.
通过对等温时效与温度循环两种条件下钎料与基板间金属间化合物(IMC)生长的对比,研究了界面IMC生长的规律。
6) intermetallic compounds
金属间化合物
1.
Refinement of intermetallic compounds of Zn-2Ni alloy;
Zn-2Ni合金金属间化合物的细化
2.
Effects of intermetallic compounds on the properties of Sn-Ag-Cu lead-free solder joints;
金属间化合物对Sn-Ag-Cu无铅钎料钎焊接头性能的影响
3.
The growth behaviors of intermetallic compounds between Sn-3.5Ag and Cu substrate;
Sn-3.5Ag/Cu界面金属间化合物的生长行为研究
补充资料：Ti_(3)Al基合金(金属间化合物)涡轮导风板
Ti_(3)Al基合金(金属间化合物)涡轮导风板
TiaA，基合金(金属间化合物)涡、、风*。利;:，
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参考词条