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1)  anodic solution
阳极溶液
2)  Metal anode/solution interface
金属阳极/溶液界面
3)  ASV
阳极溶出
1.
Presence of natural occurring organic ligands may result in overestimation of free metal content by ASV technique.
利用阳极溶出伏安法测得的水相游离金属含量通常偏高。
2.
The processes oftransformation and masstransfer occurringin stagnantfilm during deposition period of ASV measurementfor free metals were simulated using computer.
用计算机模拟了阳极溶出伏安法预电解过程中滞膜层中游离金属离子、游离配位体和配合物的转化及迁移过程。
4)  anodic dissolution
阳极溶解
1.
On the oscillation behavior and the mechanism of copper anodic dissolution in phosphoric acid solution;
磷酸溶液中铜阳极溶解的电流混沌振荡行为
2.
The anodic dissolution process of copper has been investigated in 3.
5%NaCl溶液中的阳极溶解过程,并采用SEM和EDS对表面产物进行了分析。
3.
The electrodeposition and anodic dissolution of Te on Pt Electrode in Acidic Media has been investigated by using cyclic voltammetry and EQCM.
结果表明:Te的电沉积过程比较复杂,在不同电位区间,其电沉积可以是4-电子、1-电子或者2-电子过程;在较负电位下,Te可进一步还原成H2Te;本体Te阳极溶解过程先为4-电子,后为6-电子过程。
5)  anodic dissolution
阳极溶出
1.
The anodic dissolution and electrodeposition of Ag and effect of allyl thiourea(ATU)on the processes in acidic media have been investigated by using cyclic voltammetry(CV)and electrochemical quartz crystal microbalance(EQCM).
运用循环伏安(CV)和电化学石英晶体微天平(EQCM)方法研究了酸性介质中银阳极溶出和阴极沉积过程以及丙烯基硫脲(ATU)对该过程的影响。
2.
The anodic dissolution and cathodic deposition of Cu is an important process in the field of copper-plating,electrolytic copper and electro-organic synthesis.
Cu的阳极溶出和阴极沉积是镀铜、铜电解和有机电合成等领域中一个重要的过程。
3.
The anodic dissolution and cathodic deposition of Ni on Pt electrode and effect of allyl thiourea(ATU) on the processes in NiSO4 solution were investigated by using Cyclic Voltammetry(CV) and electrochemical quartz crystal microbalance(EQCM).
采用循环伏安(CV)和电化学石英晶体微天平(EQCM)方法研究了硫酸镍溶液中Ni在Pt电极上阳极溶出和阴极沉积过程以及丙烯基硫脲(ATU)对该过程的影响。
6)  Anodic stripping voltammetry
阳极溶出
补充资料:银阳极泥提银(见铜阳极泥提金银)


银阳极泥提银(见铜阳极泥提金银)
extraction of silver from silver anode slime

y In yongJ,nl tlyln银阳极泥提银(extraetion of Silve:fr()nl 511一ver anode slime)见铜阳极泥提金银
说明:补充资料仅用于学习参考,请勿用于其它任何用途。
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