1) fine-grain
微细晶粒
2) sub-micron grained
亚微细晶粒
1.
The cemented carbide inserts made of sub-micron grained carbides tungsten and 13% cobalt were used on 81/2XA537 three-roller bits.
将钴含量为 13%的亚微细晶粒硬质合金钻齿应用到 81/ 2 XA5 37三牙轮钻头上 ,并运用扫描电镜和光学显微镜等手段对亚微细晶粒硬质合金钻齿进行了失效分析。
3) Micro
微细
1.
Micro 3D structure machining with simple shaped electrode can't generally apply the method of common mechanical milling for the reason of electrode wear, Machining conditions and etc.
利用简单电极进行微细三维结构的加工在实际工作中由于受到电极损耗、电参数选则的因素等影响不能完全套用普通机械铣削的加工模式,针对当前实际应用过程中简单电极进行微细三维结构时普遍结构简单的问题,进行实用性研究,结合适用于电火花加工的轨迹对具有代表性微小火箭发动机涡轮喷嘴叶珊环进行加工。
2.
Series experiments of micro slot confirm the proposed compensation process and the algorithm.
针对三维金属微细结构的微细电火花加工,应用等损耗理论,采用分层加工的方法,建立了单道加工时底面形状随电极损耗而变化的轮廓模型。
4) micro-cutting
微细切削
1.
Development of miniaturized numerical control milling machine tool used in micro-cutting;
微细切削用小型数控铣床的研制
2.
In this paper,the main form,practicable field and technical system of micro-cutting were analyzed based on the characteristic and micro-machining demand of microstructure.
微细切削技术是面向金属与合金等非硅材料微小型结构件精密加工需求的关键技术。
3.
Based on a machining example, the NC turning technology for a micro-structure composed of straight groove and curve profile groove in the part's internal hole is introduced, the machining effect and some technic problems in micro-cutting are analyzed.
通过加工实例,介绍了零件内孔中由微细直槽和曲线沟槽组成的微细结构的数控车削加工方法,分析了加工效果及微细切削加工的一些技术难题。
5) micro-electroforming
微细电铸
1.
During the micro-electroforming process,the current density distribution in cathode surface has directly impact on the electro-deposition quality.
微细电铸过程中,阴极表面的电流密度分布直接影响沉积层的质量。
2.
The effect of the rare earth nano-La2O3 added to the basic sulfamate solution on micro-electroforming process was studied.
将纳米稀土La2O3作为添加剂,研究其在微细电铸镍工艺过程中的影响。
6) micro electroforming
微细电铸
1.
In order to improve the micro electroforming quality of a microstructure,the characteristics of the micro electroforming process were discussed systematically and the properties of the electric field and flow field were analyzed.
在分析微细电铸的电场与流场特性的基础上,深入研究了铸层厚度的不均匀现象及搅拌方式和电流密度对微细电铸质量的影响。
参考词条
补充资料：Assembly晶粒封装
以树酯或陶瓷材料，将晶粒包在其中，以达到保护晶粒，隔绝环境污染的目的，而此一连串的加工过程，即称为晶粒封装（assembly）。封装的材料不同，其封装的作法亦不同，本公司几乎都是以树酯材料作晶粒的封装，制程包括：芯片切割→晶粒目检→晶粒上「架」（导线架，即lead frame）→焊线→模压封装→稳定烘烤（使树酯物性稳定）→切框、弯脚成型→脚沾锡→盖印→完成。以树酯为材料之ic，通常用于消费性产品，如计算机、计算器，而以陶瓷作封装材料之ic，属于高性赖度之组件，通常用于飞弹、火箭等较精密的产品上。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。