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1)  printed circuit board paper
覆铜箔板纸
1.
The manufacturing process and application of the printed circuit board paper are briefly introduced in this paper.
介绍了覆铜箔板纸的用途,覆铜箔板的制造过程和应用。
2)  printed circuit board
覆铜箔板
1.
The manufacturing process and application of the printed circuit board paper are briefly introduced in this paper.
介绍了覆铜箔板纸的用途,覆铜箔板的制造过程和应用。
2.
It has been demonstrated that the recycled particle from printed circuit board waste can be used as a filler aod reinforcement in thermoplastic PP, PE, PVC and thermosetting BMC.
本文介绍了覆铜箔板废料的回收处理路线,研究了其回收粒料对热塑性PP、PE、PVC和热固性 BMC填充和增强的作用。
3)  copper-clad laminate
覆铜箔板
1.
It was confirmed that convention fabrication process for FR-5 laminate was applicable to copper-clad laminates fabrication for the epocy-silicon hybrid resin.
概述了基于新概念的环氧-硅复合树脂的开发,并证实了传统FR-5基材的制造工艺可以适用于环氧-硅复合树脂的覆铜箔板制造。
2.
This paper describes the requirment,characteristic and application of low thermal expansion high elastic modulus glass epoxy copper-clad laminat
概述了低热膨高弹性模量覆铜箔板的必要性、特征和用途。
4)  phenolic paper copper bearing laminated material
酚醛纸质覆铜箔层压板
5)  phenolic cellulose paper copper-clad laminates(phenolic/paper CCL)
酚醛纸质覆铜箔板
6)  epoxide cellulose paper copper-clad laminates (epoxy/paper CCL)
环氧纸质覆铜箔板
补充资料:牛皮箱板纸
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性质:用于生产纸箱的牛皮板纸。定量一般在200g/m2以上。具有较高的抗张、耐破、环压等强度,良好的表面性能、印刷适应性和平滑度。主要使用未漂硫酸盐木浆,在圆网纸机上抄造。一般不用挂面,但芯浆和面浆可以使用不同的浆料。产品大多不经压光。产品有平板纸,亦有卷筒纸。主要用于生产纸盒、包装纸箱和瓦楞纸箱等。

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