1) alloying elements(Cu、Mo、Nb)
合金元素(Cu、Mo、Nb)
2) Ni、Mo、Cu alloy element
Ni、Mo、Cu合金元素
3) Cu-Nb alloy
Cu-Nb合金
4) Mo/Cu alloy
Mo/Cu合金
5) Mo-Cu alloy
Mo-Cu合金
1.
Progress in preparation of Mo-Cu alloy;
Mo-Cu合金研究方法进展
2.
Influence of Activated Element Co on Properties of Mo-Cu Alloy
活化元素Co对Mo-Cu合金性能的影响
3.
Mo-Cu alloy of high thermal conductivity and low thermal expansion coefficient is widely used as electrical packaging material and heat sink material.
Mo-Cu合金具有高的热导率和低的线胀系数,被广泛用作热深材料和电子封装材料。
6) Mo-Cu alloys
Mo-Cu合金
1.
Mo-Cu composites were manufactured by relatively low cost infiltration method on the base of summing-up outward and inside production technologies of Mo-Cu alloys.
在总结国内外Mo-Cu合金生产工艺的基础上,采用生产成本相对较低的熔渗法制备Mo-Cu复合材料。
2.
Mo-Cu alloys used in integrated circuits were prepared by liquid phase sintering and special densification treatment from the mechanical activated powders.
采用机械活化处理的粉末,经过液相烧结与特殊致密化处理,制备了集成电路用Mo-Cu合金。
3.
The microstructures of Mo-Cu alloys were studied by scanning electron microscope,and the investigation focused on the effect of sintering parameters on properties and microstructures of Mo-Cu alloys.
通过扫描电子显微镜对合金的微观组织进行了观察,重点对Mo-Cu合金的烧结工艺进行了研究,分析了影响Mo-Cu合金致密度及组织性能的影响因素。
补充资料：A1-Cu-Co合金中十次对称准晶单晶体及其衍射图
A1-Cu-Co合金中十次对称准晶单晶体及其衍射图
‘ Al Cu—Co合金中十次对称准晶堕晶体e1)及其衍射圈(z) 中国科学盹垒禹研览听供稿
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
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