1) Material Removing Function
材料去除函数
2) Material removal
材料去除
1.
Research on material removal of magnetorheological finishing;
磁流变抛光材料去除的研究
2.
Study on material removal theoretical model of zone polishing technology
环带抛光技术材料去除理论模型研究
3.
Analyzing the understanding of previous polishing mechanism,our comprehension and hypothesis of material removal mechanism of super smooth surface polishing are enunciated.
胶体SiO2抛光LBO晶体获得无损伤的超光滑表面,结合前人对抛光机理的认识,探讨了超光滑表面抛光的材料去除机理,分析了化学机械抛光中的原子级材料去除机理。
3) removal function
去除函数
1.
Magnetorheological finishing tool and removal function;
磁流变抛光工具及其去除函数
2.
Controllability of removal function in the ion beam figuring process for optics mirrors;
光学镜面离子束加工去除函数工艺可控性分析
3.
Influence of the parameters of ion beam on the removal function in IBF process;
束流参数对光学镜面离子束加工去除函数的影响分析
4) the removal function
去除函数
1.
The effect of the three kinds of material on the removal function is studied.
研究了计算机控制小工具抛光(CCOP)加工中三种常用的磨盘材料对去除函数特性的影响,进一步完善材料去除模型,用以指导光学零件的加工。
5) removing function
去除函数
1.
The plane motion is discussed based on Preston equation,the workpiece is analog computed with the motion removing function.
利用Preston方程,对实际中的磨头运动方式(平转动)进行了讨论,并用此运动方式的去除函数对一工件进行了模拟计算,同时用目前大口径光学元件的评价参数P -V值,RMS值,以及波前梯度对模拟结果进行了分析。
2.
Kinematic principles were applied to deduce the removing function of polishing pad of dual-rotator mechanism according to the Preston assumption.
以Preston假设为基础 ,运用运动学理论推导了自研双转子机构的去除函数。
3.
The base concept for computer controlled optical polishing (CCOP) is the deciding of material removing function of the subaperture polishing pad.
抛光盘去除函数的确定是数控抛光技术的应用基础,以Preston 方程为基础,应用运动学原理推导了抛光盘在行星运动及平转动两种运动方式下的材料去除函数,并通过计算机模拟出相应的工作特性曲线。
6) material removal rate
材料去除率
1.
Contrastive experiments on conventional lapping and ultrasonic lapping indicate that the material removal rate of the latter is three times that of the former.
进行了普通与超声研齿对比试验表明,超声研齿材料去除率可达到普通研磨的三倍,齿面微切削与塑性流动纹理明显,点蚀深度、划痕长短均匀,齿面质量明显优于普通研磨齿面,即粗糙度低至0。
2.
Both high material removal rate(MRR) and smooth surface have to be achieved in primary chemical mechanical polishing(CMP) of hard disk substrates.
硬盘盘基片粗抛光必须在较高材料去除率的基础上获得高表面质量。
3.
The relationship between the material removal rate and the machining parameters is discussed by experiments.
以玻璃为被加工工件的材料,对数控旋转超声加工的工艺进行了初步试验研究,分析了材料去除的机理,通过工艺试验探讨了磨料粒度、工具旋转转速、工作台进给速度、分层厚度等工艺参数对材料去除率的影响。
补充资料:恒定材料去除率是硬铣的关键
图1:摆动铣削的应用可以产生比较恒定的刀具负载水准。 | |
图2:对于相同的切深,刀具咬合方面的差异可能改变刀具负载和表面粗糙度。 |
刀具路径调整
对较小刀具的编程
刀具咬合
说明:补充资料仅用于学习参考,请勿用于其它任何用途。
参考词条