1) stress analysis
应力解析
1.
The solder joint shape of MCM bonded with flip chip is studied and its design principle and method based on stress analysis is presented.
通过对以ＦＣ技术形成的ＭＣＭ焊点接合部形态问题进行研究，提出了基于应力解析的ＭＣＭ焊点形态设计原理和方法，并对ＭＣＭ焊点热变形模型的建立等问题进行了探讨。
2.
In order to evaluate autogenous shrinkage stress of high performance concrete (HPC) due to autogenous shrinkage exactly, it is necessary to develop effective stress analysis method and study deeply time-dependence of compressive strength, Young\'s modulus, creep and autogenous shrinkage.
有效的应力解析方法的建立和包括从早龄期开始的强度、弹性模量、徐变等混凝土物性以及自收缩随时间发展规律的把握是准确评价高性能混凝土的自收缩引起的自收缩应力的前提。
2) Analytic solution of stress
应力解析解
3) analytical solutions/stress singularity
解析解/应力奇性
4) stress analytic method
应力解析方法
5) stresses / approximate analysis method
应力/近似解析法
6) stress analytical model
应力解析模型
补充资料：轧辊残余应力(见轧辊应力)
轧辊残余应力(见轧辊应力)
residual stresses in roll
zhagun eanyu yingli轧辊残余应力(residual stresses in roll)见礼辐应力。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条