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1)  photoresists containing wastewater
光致抗蚀剂废水
1.
The inorganic and organic pollutants in the photoresists containing wastewater after the treatment of the iron chipping micro electrolysis are analyzed by ICP-AES and GC-MS.
采用色谱 -质谱联用分析仪和电感耦合等离子体发射光谱仪分析和鉴定了光致抗蚀剂废水中的污染物。
2)  Photoresists
光致抗蚀剂
1.
The importance of photoresists in microelectronic industry is described in this review,emphasizing the characteristics of polysilane photoresists and the developing situation of ultra violet, deep ultraviolet, X-ray,electron-beam polysilane photoresists etc.
概述了光致抗蚀剂在微电子工业中的作用,着重介绍了聚硅烷光致抗蚀剂的特点,以及聚硅烷紫外、深紫外、X射线、电子未等抗蚀剂的发展状
2.
Polysilynes, a new kind of high-performance materials, are reviewed on the present investigation of their synthesis, structure, reactions and applications as semiconductors, conductive SiC thin films, optical waveguides and photoresists.
本文综述了一类新型的高功能材料——聚硅炔的合成、结构、反应以及作为半导体、导电性SiC薄膜、光学波导器和光致抗蚀剂的应用的研究现状。
3)  photoresist [,fəutəuri'zist]
光致抗蚀剂
1.
Preparation of Cresol-formaldehyde Resins Used for Making Positive Photoresist;
正性光致抗蚀剂用酚醛树脂的制备
2.
Research progress and application status of UV positive photoresist;
紫外正性光致抗蚀剂的研究进展及应用现状
3.
Experiments on two-photon Optical storage in photoresist;
以光致抗蚀剂为记录介质的双光子存储实验
4)  water-soluble negative photoresist
水溶性负性光致抗蚀剂
5)  water-soluble photoresist
水溶性光致抗蚀剂
1.
Studies on water-soluble photoresists during the last decade have been summarized in two parts: traditional photochemical reaction type and chemically amplified type.
本文按传统光化学反应型和化学增幅型两种类型对近10年水溶性光致抗蚀剂的发展状况做了分类总结,并重点介绍了成像反应原理和各体系的优缺点。
6)  positive photoresist
正型光致抗蚀剂
1.
This paper focuses on the positive photoresist’s application performance influence that the graft matrix and 2,1,5-sulfonylchloride(2-azo-1-naphthoquinone-5-sulfonyl chloride)(NDQ),which are used for composing LCD positive photoresist sensitive resin(PAC).
本文研究了液晶显示器件(LCD)正型光致抗蚀剂用感光树脂(PAC)所需接枝母体和2,1,5-重氮萘醌磺酰氯(NDQ)对正型光致抗蚀剂应用性能的影响。
补充资料:干膜光致抗蚀剂
分子式:
CAS号:

性质: 将无溶剂型光致抗蚀剂涂在涤纶片基上,再覆上聚乙烯薄膜。使用时揭去聚乙烯薄膜,把干胶层压在版基上,经曝光显影处理,即可形成图像。主要是利用多官能团的丙烯酸酯类单体或带双键的丙烯酸酯光敏树脂在光引发剂存在下,由光引发聚合反应产生交联结构而达到成像目的。多用于印刷线路板等的生产。

说明:补充资料仅用于学习参考,请勿用于其它任何用途。
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