1) lead frame
集成电路引线框架
1.
Application of continuous high speed plating technology in IC lead frame production;
连续高速电镀技术在集成电路引线框架生产中的应用
2) beam-lead-isolated integrated circuit
梁式引线隔离集成电路
3) beam lead integrated circuit
梁式引线集成电路
4) beam lead integrated circuit
粱式引线集成电路
5) lead frame
引线框架
1.
Study on heat treatment process of C194 copper alloy for lead frame;
引线框架用铜合金C194热处理工艺研究
2.
Development of Cu-Ni-Si alloy for lead frame;
引线框架用Cu-Ni-Si合金的发展
3.
Microstructure and properties of Cu-Ni-Si based alloys for lead frame;
Cu-Ni-Si基引线框架合金的组织和性能
6) Leadframe
引线框架
1.
When the leadframe made of 4J42 alloy is brazed to the brazing zone of an alumina substrate using an AgCu28 filler in ceramic DIP production, the liquid filler often flows onto the surface of the leadframe after brazing, and the quality of finished products is influenced greatly.
陶瓷DIP外壳需要使用AgCu28钎料将4J42合金引线框架与陶瓷基板的焊区钎焊在一起,焊后易出现钎料在引线框架上流淌的问题,影响产品的质量。
2.
Inthispaper,themicrostructuresandtheirchangesinhightemperatureoftheinterfacesbetweenfourcivilcopperalloysforleadframeandSn -Pbsolderalloysarestudied .
研究了四种国产引线框架用铜合金与Sn -Pb共晶焊料的界面结构及其在高温保温过程中的变化。
3.
It was discussed the leadframe driving structure moving along line intermittently, especially the principle of the 3D cam in the designed die bonder.
讨论了IC芯片粘片机的引线框架直线间歇式供送机构和空间凸轮的工作原理。
补充资料：BiCMOS集成电路