1) tundish temperature
中包温度
1.
To improve billet quality and the trackability and stability of secondary cooling water during continuous casting,the tundish temperature is introduced into the water distribution for secondary cooling to design the relevant control system,based on the distribution model,tundish temperature,surface temperature and fuzzy self-adaptive PID.
为改善铸坯质量,提高二冷水量的跟踪性和稳定性,将中包温度引入二冷配水,设计出基于配水模型、中包温度、铸坯表面温度及模糊自适应PID的连铸二冷控制系统,并在实验室搭建连铸二冷区喷淋仿真实验系统。
2) tundish temperature
中间包温度
1.
Prediction of solidification position based on variation of tundish temperature and its application;
基于中间包温度变化的铸坯凝固位置预测及应用
3) temperature field/tundish
温度场/中间包
5) packing temperature
包装温度
1.
The main factors affecting DAP caking are discussed: higher packing temperature(60℃actually while 50℃designed),too many tiny particles(1～2 mm),higher moisture(2.
分析影响磷酸二铵产品结块的主要因素:包装温度高(设计≤50℃;实际≥60℃);细小颗粒(1~2mm)较多;水分含量高(2。
6) Lining Temperature
包衬温度
1.
Effect of Regenerative Baking on Lining Temperature Uniformity of an 160 t Ladle;
蓄热式烘烤对160t钢包衬温度均匀性的影响
补充资料：铂电阻温度表(见电阻温度表)
铂电阻温度表(见电阻温度表)
表。bod旧nZu wendubiao铂电阻温度表见电阻温
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条