1) ceramic coat of Si_3N_4-BN
Si3N4-BN陶瓷薄膜
2) Si 3N 4/BN laminated ceramics
Si3N4/BN层状陶瓷
3) h-BN/Si3N4 ceramic composite
h-BN/Si3N4陶瓷复合材料
1.
The effects of h-BN content on the fracture behavior and toughness of the h-BN/Si3N4 ceramic composites were investigated.
以亚微米级α-Si3N4和h-BN粉末为原料,Y2O3-Al2O3为助烧剂,采用热压烧结制备了h-BN/Si3N4陶瓷复合材料。
4) ceramic film
陶瓷薄膜
1.
The Zr-Co ceramic film was formed by using the powders after sintering at special temperature.
在调节剂柠檬酸铵的作用下,采用溶胶凝胶法制备了Y稳定的Zr-Co粉体,经高温烧结制得致密陶瓷薄膜。
2.
And finally the dense phosphate ceramic film was formed after sintering at special temperature.
在有机调整剂CTAB的作用下,将磷酸二氢铝溶液用氨水调节pH值在一定温度下合成纳米磷酸铝粉体,然后经高温烧结制得致密陶瓷薄膜。
3.
There are many techniques for fabricating ceramic films such as PVD,CVD,high-temperature sintering and sol-gel method.
陶瓷薄膜的制备技术多种多样,如物理气相沉积、化学气相沉积、高温烧结和"溶胶-凝胶"法等。
6) ceramic thin film
陶瓷薄膜
1.
Most of oxide ceramic thin films have prepared conveniently by ASSP (arrangement of synthesized solid particle) method with common inorganic precussors.
以常用无机盐为前驱体，通过化学合成固相粒子排布（ASSP—arrangementofsynthesizedsolidPartical）途径，可以方便地制备绝大多数氧化物陶瓷薄膜。
2.
The characteristics of methods for preparing ceramic thin films, namely physical and chemical methods, have been elaborated, and the applications of ceramic thin films have been summarized based on their unusual hardness and unique electrical behavior as oxides and non-oxides.
对各种薄膜制备方法的特点(即物理方法、化学方法)进行阐述,并且从氧化物和非氧化物的角度,综述了陶瓷薄膜作为硬质薄膜、气敏薄膜以及铁电、压电等微电子薄膜的应用。
补充资料：氮化硅(si_(3)N_(2))基陶瓷制品
氮化硅(si_(3)N_(2))基陶瓷制品
氟化硅(s11N z)基陶瓷制品中国科学院上海硅酸盐研究所供稿
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条