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1)  diamond covering plate
金刚石覆镀
2)  metal-coated diamond abrasive
金属镀覆金刚石
1.
This paper firstly studied the bonding mechanism of the photosensitive resin blade,and then introduced the effective measures to improve the quality for photosensitive resin blade by means of the metal-coated diamond abrasive and studied the change of bonding ability of the blade compared with conventional abrasive.
首次在光固化树脂结合剂锯片中引进几种金属镀覆的金刚石磨料,通过对不同半导体材料进行切割试验,证实了在光固化树脂结合剂锯片中采用金属镀覆金刚石磨料后,针对单晶硅、铌酸锂、陶瓷等半导体材料,几种不同锯片的磨损率分别降低了25%~200%、12。
3)  Diamond coating
金刚石镀膜
1.
In this paper, two technical methods: the diamond coating and the addition of rare earth elements to matrix materials, are proposed, in line with the results derived from the experimental research, to improve the thermal stability of diamonds, the cohesion of matrix materials to the diamonds and their corresponding performance.
根据实验研究结果建议从金刚石镀膜、胎体添加稀土元素两个方面来提高金刚石的热稳定性、胎体对胎体的包镶能力及其使用性能 。
4)  Ti-coated diamond
镀钛金刚石
1.
Study on brazing of Ti-coated diamond with Ni-Cr filler;
Ni-Cr合金钎焊镀钛金刚石的研究
2.
The bonding between iron-, nickel-, cobalt-, copper-matrix powders and Ti-coated diamonds under hot-pressing condition have been studied using transverse rupture strength (TRS) testing, SEM and EDAX.
利用抗弯强度试验及扫描电镜分析,研究了磁控溅射镀钛金刚石在Co基、Fe基、Ni基及Cu基结合剂中的界面结合状态。
5)  diamond electroplating
电镀金刚石
6)  diamond electroplating
金刚石电镀
1.
Distributed automatic control system for diamond electroplating;
分布式金刚石电镀自动控制系统
补充资料:镀覆用化学品
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性质:在印制电路板生产中涉及到化学镀铜、电镀铜、电镀锡/铅、电镀金、电镀镍等许多镀覆工艺。在基板上镀覆金属镀层主要有以下作用:(1)在通孔上进行化学镀以使双面板正反面相连或使多层板各层相连;(2)电镀通孔或在板上电镀电路图形;(3)在电路上镀保护层以防其氧化并作为下道腐蚀工序的抗蚀镀层;(4)在印制板上镀覆接触键(插头座)。另外,在集成电路和电子元器件生产制造过程中也涉及许多镀覆工艺。镀覆化学品系指上述镀覆工艺使用的一系列化学镀液和化合物。化学镀液的技术性、专用性、配套性很强,同一类镀液各公司的配方不尽相同,镀液性能及其使用工艺对镀层的质量有很大影响。

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