1) key materials
关键材料
1.
Based on requirement of national development and background of international industry and R&D in related field,the challenge and opportunity of development in passive electronic components and their key materials in China are analysed,some strategic suggestions are proposed.
从国家发展需求和国际相关领域产业发展和研究开发的背景出发,分析了我国无源电子元件关键材料发展的挑战和机遇,提出了近几年相关领域研究发展的战略建议。
2.
Firstly,the development of key materials of MEA,i.
首先,对组成MEA的关键材料,如电催化剂、质子交换膜、扩散层的研究进展进行了介绍,认为开发低温高效、贵金属载量低的电催化剂以及研制低成本、低甲醇渗透的非氟质子交换膜是MEA关键材料的研究方向。
2) common key materials
通用关键材料
3) bonding material
键合材料
1.
Ag paste and the 250 ℃ and 130 ℃ solder pastes were used as bonding materials of 1 W white LED,and their junction temperature,thermal resistance as well as light attenuation were compared and discussed.
对采用银浆和250℃、130℃度高、低温锡膏作为芯片键合材料的1W白光LED结温、热阻和光衰进行了对比研究。
4) Key Materiel
关键物料
5) critical information
关键资料
6) The important thing is the teaching materials we use.
关键是教材。
补充资料:恒定材料去除率是硬铣的关键
图1:摆动铣削的应用可以产生比较恒定的刀具负载水准。 | |
图2:对于相同的切深,刀具咬合方面的差异可能改变刀具负载和表面粗糙度。 |
刀具路径调整
对较小刀具的编程
刀具咬合
说明:补充资料仅用于学习参考,请勿用于其它任何用途。
参考词条