1) re-close sequence
重合时序
1.
Influence of single-phase re-close sequence on system transient stability;
单相重合时序对系统暂态稳定的影响
2) superposition
重合
1.
The resolution of removing transformation is removed first, and removing equations are given; then the resolving expression of superposition through three revolving is given; it is based on projection when the dual points were obtained.
一般移动变换分解为先平移,并给出移动变换的平移方程组,求得重合的对应点之后,在投影的基础上,经三次旋转,使得同向合同不重合的形体达到重合,并建立了解析表达式。
2.
The general removal transformation is being resolved as a translation in advance, and then after finding the superposed point of correspondence to obtain the analytical expression of superposition by means of three time of rotation based on projection.
给出了移动变换定义;一般移动变换分解为先平移,求得重合的对应点之后,在投影的基础上,经三次旋转达到重合的解析表达式;给出了相关的程序框图。
3) coincidence
重合
1.
Coincidence Theorems Involving Better Admissible Mappings and Φ-Mappings in G-Convex Spaces;
G-凸空间内涉及较好容许映象和Φ-映象的重合定理(英文)
2.
As applications,a Ky Fan matching theorem for transfer open covers,a Fan- Browder coincidence theorem and maximal element theorem are established.
作为应用,获得了非紧超凸度量空间中的转移开覆盖的Ky Fan匹配定理,Fan-Browder重合定理和极大元定理。
3.
In this paper,a Fan-Browder type coincidence theorem is established.
建立了一个Fan-Brawder型重合定理。
4) Recloser-recloser
重合器-重合器
5) heavy alloy
重合金
1.
W-based heavy alloys of three different compositions were prepared by metal injection moulding technology (MIM).
研究了三种钨基重合金的金属注射成形工艺（MIM），重点研究了脱脂和烧结两个工序，分析了烧结温度对力学性能、断口和显微组织的影响。
2.
W based heavy alloys of three different compositions were prepared by using metal injection moulding technology (MIM), emphasing to the debinding and sintering processes.
研究了3种钨基重合金的金属注射成形工艺(MIM),重点研究了脱脂和烧结两个工序,分析了烧结温度对机械性能、断口和显微组织的影响,列举了烧结收缩、机械性能和最佳烧结温度等数据。
3.
The distribution of trace Si (400 ppm), which was doped intentionally in raw tungsten powder, in W-7Ni-3Fe heavy alloy as well as the behavior of the impurities during the liquid phase sintering were investigated by scanning electron microscope and electron microprobe analysis.
研究了掺到原料Ｗ粉中微量Ｓｉ（４００ｐｐｍ）在Ｗ－７Ｎｉ－３Ｆｅ重合金中的分布及在液相烧结过程中的行为。
6) overlapping of shoulder line
肩线重合
参考词条
补充资料：套刻重合
分子式：
CAS号：
性质：晶片上每一点定义的矢量，这是基片几何图形的矢量位置和套刻图形(可以由光致抗蚀剂组成)相应点矢量位置之间的差称作。= 。
CAS号：
性质：晶片上每一点定义的矢量，这是基片几何图形的矢量位置和套刻图形(可以由光致抗蚀剂组成)相应点矢量位置之间的差称作。= 。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。