3) Copper micro rod
Cu微米杆
1.
Copper micro rod materials with the coating thickness of 200 nm and the grain size of 20 nm on Nocadia (0.
6μm的诺卡氏(Nocadia)菌体表面成功沉积了厚度约为200 nm、晶粒尺寸约为20 nm的Cu镀层,制备出新型Cu微米杆材料。
4) Copper film microbridge
Cu膜微桥
5) Cu content
Cu含量
1.
Effect of Cu content on rapid sintering W-Cu alloy under the action of electric field;
Cu含量对电场快速烧结W-Cu合金的影响
2.
Effect of Cu Content on the Behavior of Solid Solution Treated Al-Mg-Si Alloy;
Cu含量对Al-Mg-Si合金固溶处理行为的影响
3.
The effect of Al and Cu content on mechanical properties and fluidity of Zn-Al-Cu-Mg mould alloy is studied.
研究了Al、Cu含量对Zn-Al-Cu-Mg模具合金力学性能和铸造流动性的影响。
6) copper content
Cu含量
1.
TiB2 based cermets with different copper content were produced from titanium powder, boron powder and copper powder by Self-propagating High-temperature Synthesis under conditions of Pseudo Hot Isostat-ic Pressing (SHS/PHIP).
利用自蔓延高温燃烧合成结合准热等静压技术制备了不同Cu含量的TiB2-Cu基金属陶瓷。
补充资料：A1-Cu-Co合金中十次对称准晶单晶体及其衍射图
A1-Cu-Co合金中十次对称准晶单晶体及其衍射图
‘ Al Cu—Co合金中十次对称准晶堕晶体e1)及其衍射圈(z) 中国科学盹垒禹研览听供稿
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条