1) surface damage of pure tungsten
纯钨表面损伤
2) surface damage
表面损伤
1.
Prediction of surface damage for Al_2O_(3s)f/2A12 composites by liquid infiltration-extrusion process
液态浸渗挤压Al_2O_(3sf)/2A12铝基复合材料表面损伤的预测
2.
It is pointed out by the brittle fracture appearance observation of 80 steel wire rod and microstructure analysis that the plastic distortion of basal metal and dislocation adding at surface damage position are the main cause of wire drawing breaking.
通过对80钢盘条脆断断口形貌观察和金相组织分析,认为盘条表面损伤部位的金属基体产生塑性变形和位错增加是拉拔断丝的主要原因,在高碳钢生产及吊装运输中应采取措施避免盘条擦伤,以提高产品质量。
3.
Surface damages of Te solvent and Bridgman grown HgCdTe wafers have beenstudied with X-ray reflection topography.
根据实验结果分析，认为机械划痕是精磨精抛过程中的主要损伤结构，并提出一个新的表面损伤模型──表面不完全损伤模型。
3) damage surface
损伤表面
1.
Application of fractal for damage surface of concrete;
分形理论在混凝土损伤表面的应用
4) subsurface damage
亚表面损伤
1.
This paper investigated the influence of abrasive size,load and spindle speed in grinding process on surface/subsurface damage of Nd-doped phosphate glass experimentally.
系统地研究了光学研磨过程中,磨料粒径、载荷大小以及机床转速对钕玻璃表面及亚表面损伤的影响。
2.
A molecular dynamics(MD) simulation is carried out to analyze the effect of cutting edge radius,cut-depth,and grinding speed on the depth of subsurface damage layers in monocrystal silicon grinding processes on an atomic scale.
应用分子动力学仿真研究了原子量级条件下磨粒钝圆半径、磨削深度和磨削速度对单晶硅磨削后亚表面损伤层深度的影响。
3.
For the subsurface damage layer of optical materials in grinding process, a combined method of MRF spot technique and HF acid differential chemical etch rate method was proposed to measure the depth of subsurface crack layer and thickness of residual stress layer.
针对光学材料磨削加工引入的亚表面损伤层,综合使用磁流变抛光斑点技术和HF差动化学蚀刻速率法测量亚表面裂纹层深度和亚表面残余应力层厚度。
5) surface damaged layer
表面损伤层
1.
It is founded that surface damaged layers of average thickness 60~80μm are appeared on the surface regardless of the grinding conditions.
结果表明:在不同的加工条件下,材料被加工表面均存在平均厚度为60~80μm的表面损伤层,它由加工过程中微观裂纹形成的纳米尺寸的破碎矿物颗粒组成;磨粒和工件材料之间的机械作用引起了材料表面各元素电子结合能的增大,未发现加工表面生成过程中存在化学作用和产生新物质。
6) surface damage layer
表面损伤层
1.
Mechanical polishing of CdZnTe single crystal and measurement of surface damage layer;
CdZnTe单晶的机械抛光及其表面损伤层的测定
补充资料：工业纯铝晶界间表面起泡缺陷
工业纯铝晶界间表面起泡缺陷
工业纯铝晶界间表面起泡缺陷
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条