1) FR-4 CCL
FR-4覆铜板
1.
The Research of Cause about Voids in Subsurface of FR-4 CCL;
FR-4覆铜板产品次表面气泡成因探讨
2) FR-4 PCB
FR-4电路板
1.
Build-up field computation of multiplicate condition(electron energy,PCB thickness,electron incidence pattern,and grounding) of FR-4 PCB for satellite was analyzed.
针对星用FR-4电路板计算了多种条件(电子能量、电路板厚度、电子入射方式、接地方式)下的内建电场并对其进行了详细的分析探讨。
3) FR-4 printed circuit board
FR-4型线路板
1.
To create a model for recycling technology,a waste FR-4 printed circuit board (PCB) recycling process employing supercritical fluid CO_2(SCF-CO_2) is studied using central composite design.
分析温度和处理时间对线路板的分层率、玻璃纤维布的纬向抗拉强度及二者综合效应的影响;建立回收工艺输出工艺参数的多元二次模型方程,由此得到超临界CO2回收FR-4型线路板的最佳温度和处理时间,并通过实验验证最佳温度和处理时间的准确性。
4) copper clad panel
覆铜板
1.
The effects of the feed ratio of raw materials, reaction temperature and the dosage of catalyst, etc factors on the new synthesis process of brominated epoxy resin for copper clad panel were studied.
研究了原料配比、反应温度、催化剂等因素对覆铜板专用溴化环氧树脂合成新工艺的影响。
5) CCL
覆铜板
1.
Research on the Laminate of Blends Based on Benzoxazine and Hydantoin Epoxy Resins Used in CCL;
BZ/EP树脂基覆铜板基板材料的研究
2.
Research on Halogen-free and Non-phosphorus Flame-retardant Key Resin Materials Used in CCL;
无卤无磷阻燃覆铜板关键树脂材料的研究
6) printed circuit board
覆铜箔板
1.
The manufacturing process and application of the printed circuit board paper are briefly introduced in this paper.
介绍了覆铜箔板纸的用途,覆铜箔板的制造过程和应用。
2.
It has been demonstrated that the recycled particle from printed circuit board waste can be used as a filler aod reinforcement in thermoplastic PP, PE, PVC and thermosetting BMC.
本文介绍了覆铜箔板废料的回收处理路线,研究了其回收粒料对热塑性PP、PE、PVC和热固性 BMC填充和增强的作用。
补充资料：铜板
1.铜元。 2.铜制板材。 3.铜版。 4.铜制的演唱快书等打拍子用的板状器具。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条