1) eutectic SnPb solder
SnPb共晶焊料合金
2) SnPb eutectic solder
SnPb共晶钎料
1.
Reaction kinetics between SnPb eutectic solder and Au/Ni/Cu pad during laser reflow;
激光加热条件下SnPb共晶钎料与Au/Ni/Cu焊盘界面反应动力学
2.
SnPb eutectic solder reflow on BGA pad metallized with Au/Ni to form solder bump with induction self excite heat under alternate electromagnetic radiation is performed, and impacts of induction self excite heat and solid state aging on interfacial reaction between SnPb eutectic solder and Au/Ni metallization are investigated.
进行了交变电磁辐射下附Au/Ni镀层BGA焊盘上SnPb共晶钎料球感应自发热重熔形成钎料凸台的实验,并分析了感应自发热重熔以及固态老化对SnPb共晶钎料与Au/Ni镀层焊盘界面反应的影响。
3) SnPb
SnPb焊料
4) eutectic solder
共晶焊料
5) eutectic preform
共晶合金盘料
6) Mg-Al eutectic magnesium alloy welding wires
Mg-Al共晶镁合金焊丝
补充资料：共晶焊料
分子式：
CAS号：
性质：含38.1％锑(共晶成分)的锡锑合金焊料。室温组织为共晶体，熔点较低183℃。在电子领域广泛用作焊料、连接金属。
CAS号：
性质：含38.1％锑(共晶成分)的锡锑合金焊料。室温组织为共晶体，熔点较低183℃。在电子领域广泛用作焊料、连接金属。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条