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1)  semiconductor chip assembly
半导体芯片贴装
2)  semiconductor chip
半导体芯片
1.
Parameters of silicon semiconductor chip and bridge section were designed and optimized.
优化设计了硅半导体芯片及桥区参数,并对SCB冲击片起爆HNS-Ⅳ炸药及影响发火能量的因素进行了试验研究。
2.
Through the semiconductor chip test data system\'s basic architecture description,study on the semiconductor chip test data transmission process and method,to provide an important technical support for enterprises.
通过对半导体芯片测试数据系统的基本架构描述,研究了半导体芯片测试数据传输的过程及方法,为生产企业提供了技术支持。
3)  IC [ai'si:]
半导体芯片
1.
IC Production Demand Forecasting Based on Time Sequence Method;
基于时间序列法的半导体芯片生产需求预测
2.
As an important portion of IC industry, IC fabless design house must shorten their delivery cycle time to quickly respond customer’s demand so to survive at the market.
电子信息产业的快速发展,为半导体芯片产业提供了广阔的市场和发展空间,同时也带来了激烈的市场竞争。
4)  semiconductor wafer
半导体芯片
1.
Analysis of the accuracy in the measurement for semiconductor wafer;
半导体芯片电路线宽显微测量精度分析
2.
The research result has been used in dimension measurement of semiconductor wafer.
0在实现显微图像测量中的编程技术,并应用于半导体芯片尺寸测量。
5)  semiconductor chips
半导体芯片
6)  Die Attach
芯片贴装
1.
Explore New Challenges of Wafer Level Die Attach Film for Wafer Preparation Process;
探索晶圆级芯片贴装薄膜和芯片制备集成工艺的新挑战(英文)
补充资料:半导体导电性(见半导体的导电与电荷输运)


半导体导电性(见半导体的导电与电荷输运)
electrical conductivity of semiconductor

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