1)  Indium solder
In焊料
2)  solder
焊料
1.
Experimental Research on Solder's High Temperature Mechanical Property and Thermal Cycle Numeric Simulation of Solder Joints in Electronic Package;
电子封装焊料高温力学性能实验及焊点热循环数值模拟研究
2.
Study on the Process and Mechanism of Diffusion Welding between Contact and Solder;
触头焊料扩散连接的工艺及机理研究
3.
8Cu/Cu solder joint undergoing aging was studied with a comparison to that of Sn37Pb/Cu.
结果表明:在焊料与铜基板界面上存在Cu6Sn5和Cu3Sn两种金属间化合物,时效过程中Sn3。
3)  adhesive
焊料
1.
A kind of adhesive,which was mainly composed of SiC,was used to join Si_3N_4/SiC ceramic presslessly.
采用以碳化硅为主相的焊料,在无压的条件下,连接氮化硅结合碳化硅陶瓷。
2.
The sintered adhesive is mainly composed of S3N4 and O'-sialon,which have good physical chemistry compatibility with the parent material.
用硅粉、黏土、硅溶胶配制的浆料作为焊料,在1390℃氮化烧结过程中,对经过预氮化的氮化硅陶瓷进行无压反应烧结连接。
3.
The chemical composition of adhesive has significant influence on the joining strength.
陶瓷连接技术是结构陶瓷实用化的有效手段 ,焊料成分对连接体的性能具有决定性作用。
4)  filler metal
焊料
5)  tin solder
锡焊料
1.
Determination of mercury in tin solder by microhydride generation-atomic absorption spectrometry;
微型氢化物发生-原子吸收光谱法测定锡焊料中汞
2.
Besides,some problems that confront tin solder sector after China's WTO accession shall be properly dealt with.
本文阐述了锡市场形势,包括国内生产、锡的消费及后市预测,说明了加入WTO后对我国锡工业发展的影响,最后提出了锡焊料行业入世后需要适应的几个问题。
6)  aluminum foil
铝钎焊料
1.
The manufacture process of aluminum foil was analyzed, explained the performance and the merit of the polyurethane rubber punching die.
分析了铝钎焊料的加工工艺,说明了聚氨酯橡胶模的性能和优点。
参考词条
补充资料：镉焊料
分子式：
CAS号：

性质：含82％镉、18％锌的合金。又称镉钎焊合金。工业上广泛用于焊接工艺。熔融法制备。

说明：补充资料仅用于学习参考，请勿用于其它任何用途。