1) wiring shaping equipment
布线形成设备
1.
The world semiconductor equipment market in the year 1999～2000, consist of the equipment investment, the photolithography equipment and the wiring shaping equipment are introduced.
介绍了１９９９ ～２０００ 年世界半导体设备市场，包括设备投资、光刻机和布线形成设备。
2) cabling equipment
成缆设备、布线设备
4) axial lead former
轴向引线成形设备
5) micro forming apparatuses
微成形设备
补充资料：净化设备——混凝设备
净化设备——混凝设备    | |
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说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条