Based on a developed UEV(ultrasonic elliptic vibration)-CMP(chemical mechanical polishing) hybrid polishing system used for silicon wafer,the experimental investigation of the effect of controllable process parameters(i.

Research on surface integrity in ultrasonic elliptic vibration grinding of ZTA ceramics;

The conditions to get the elliptic vibration and the design method of the system structure were also proposed based on above analyses.

The principle of the ultrasonic elliptic vibration produced by polishing tool is introduced and elliptic motion characteristics of the polishing tool are tested.

Transducer of the ultrasonic elliptical vibration cutting based on the finite element method;

Based on experiments of the face cutting of the weak workpiece,effects of the ultrasonic elliptical vibration cutting on the weak workpiece are researched.

The paper discusses the structure,principles and characteristics of a new elliptical vibration elastic sieve with shunt functio

With the advantages of circle vibrating screen and straight vibrating screen,elliptical vibrating screen attracts the attention of users in relevant fields.

Self-synchronous balanced elliptical shale shaker;