1)  Au-Ag-Ge brazing alloy
Au-Ag-Ge硬钎焊合金
2)  Au
Au
1.
First-Principles Study of Au-Adsorption on Clean Si(001) and H-Si(001) Surface;
Au吸附清洁及H化Si(001)表面的第一原理研究
2.
Electronic structures and physical properties of Cu,Ag and Au;
贵金属Cu、Ag、Au的电子结构和物理性质
3.
Temperature dependence of atomic states and physical properties of fcc and metastable hcp and bcc Au metals;
fcc,hcp和bcc结构Au的原子状态及物理性质随温度的变化关系
3)  gold(I)
Au(Ⅰ)
4)  Gold
Au
1.
Abstraction of Gold,Platinum and Palladium from Platinum and Palladium Concentrate;
从铂钯精矿中提取Au、Pt、Pd
2.
Strengthening of Gold via Alloying Elements;
合金元素对Au的强化效应与应用
3.
Gold is adsorbed by a polyurethane foam loaded with Methy1 isobuty1 ketone from a 5%~25% aqua regia medium, the adsorbed gold is eluted with 2% thiourea 1% hydrochloric solution.
用火焰原子吸收法测定w(Au)为19。
5)  Au(Ⅲ)
Au(Ⅲ)
1.
Electrochemical Oxidation of Selenium Amino Acids and Interaction between Selenium Amino Acids and Au(Ⅲ)/Cu(Ⅱ);
含硒氨基酸电化学氧化及其与Au(Ⅲ)、Cu(Ⅱ)的相互作用
6)  Au ̄+
Au~+
参考词条
补充资料:硬钎焊
分子式:
分子量:
CAS号:

性质:见钎焊。

说明:补充资料仅用于学习参考,请勿用于其它任何用途。