1) heat conduction mechanism
热传导机理
1.
In order to know further about temperature distribution in wellbore of dual tubing production with sub heat tracing in developing thick oil reservoirs,this paper studies the alternation of temperature and pressure in the main wellbore s fluid by using heat conduction mechanism.
为了进一步了解采用双管拌热技术开采稠油油藏时的井筒温度分布情况,利用井筒热传导机理研究了主管内流体温度和压力的变化情况。
2) conduction mechanism
传导机理
1.
So this essay focuses on the relation between the domestic and international unbalance, especially the mutual conduction mechanism.
在对二者关系的研究中,国内非均衡与国际非均衡之间的相互传导机理又成为了本研究重点。
2.
Beginning from the basic elements of supply chain risk conduction,this paper analyzes the conduction mechanism of supply chain risk.
从风险传导的基本元素出发,通过归纳分析得出供应链风险的传导机理。
3) thermal conducting mechanism
导热机理
1.
Typical theory model and thermal conducting mechanism of filled thermal conductive rubber were summarized,and the research and development status of thermal conductive systems filled with single filler and multi-fillers in the world were reviewed with 29 references,and developing prospects for thermal conductive rubber were also pointed out.
综述了填充型导热橡胶的典型理论模型和导热机理,介绍了单组分导热填料填充体系和多组分导热填料填充体系的国内外研究开发状况,指出了今后导热橡胶的开发方向。
2.
In this paper,the thermal conducting mechanism and models of thermal conductive adhesive were described,and the approaches of improving thermal conducting were also discussed.
综述了导热胶粘剂的导热机理、导热模型以及提高胶粘剂导热性能的途径；详细介绍了非绝缘导热胶粘剂和绝缘导热胶粘剂的技术研究与应用,最后对导热胶粘剂的发展前景作了展望。
3.
The thermal conducting mechanism and thermal conducting models were also described.
介绍了导热绝缘聚合物复合材料,包括复合型塑料、橡胶、胶粘剂和涂层的研究进展及其导热机理、导热模型的研究情况。
4) heat conduction mechanism
导热机理
1.
Based on the following four principles—micro-dimension effects, heat diffusion from Brownian motion, solid-liquid micro interface and particle clustering structure, the heat conduction mechanism in nanofluids was studied.
从颗粒小尺寸效应、布朗运动引起的微对流、固液吸附微界面和颗粒聚集结构上分析了纳米流体导热机理,并推导了适合纳米流体的热导率预测公式。
2.
The heat conduction mechanism is analyzed inthis paper in terms of sound quantun and photon heat conduction and macroscopic thermal properties.
本文从声子导热、光子导热和宏观热学性质三个方面分析了漂珠轻质砖的导热机理。
5) thermal mechanism
导热机理
1.
On the basis of the experimental investigation and theoretical analyses,thermal mechanism and the effect of microstructure of pyrocarbon on thermal conductivity of C/C composite were studied.
通过调节丙烯与氢气的比例得到热解炭结构分别为粗糙层(RL),光滑层(SL),各向同性(ISO)的三种C/C复合材料,研究了热解炭组织结构对C/C复合材料热导率的影响,讨论了C/C复合材料的导热机理。
6) thermal conduction mechanism
导热机理
1.
This article reviews new progress of A1N in the field of thermal conduction mechanism,and preparation of the A1N powder and A1N film.
本文综述了近年来A1N在导热机理、粉末其及薄膜制备等领域的研究进展,展望了A1N未来的发展趋势。
2.
This article reviews in detail new progress of AlN in the fild of defects,thermal conduction mechanism,processing of powder and its hydrolysis and oxidation,and sintering at present.
本文详细地综述了近年来AlN陶瓷在晶体缺陷、导热机理、粉末的制备及其水解和氧化、烧结及其应用等领域的研究进展 ,并展望了AlN未来的发展趋势。
3.
This paper describes in detail new progress abroad and at home and thermal conduction mechanism,introduces and analyzes technological process and influencing factors for A1N package preparation,sums up progress in-metalization and sintering technology,and finally suggests the development trend of AlN.
详细综述了AlN板的国内外研究现状及其导热机理;介绍并分析了基片制备的工艺流程和影响因素;概括总结了AlN基板的金属化和烧结工艺方面的研究进展;展望了AlN基板的发展趋势和前景。
补充资料：固体热传导
固体热传导
heat conduction of solid
固体热传导heat eonduetion of solid物质内部存在温度梯度时，热量从高温端向低温端的传导。是一种能量输运过程。表征物质导热能力的物理参数是热导率只。按照傅里叶定律，热导率是联系物质单位时间内、单位面积上通过的热量创热流密度)与温度梯度(gradT)之间正比关系的比例系数，即 q-一只gradT式中的负号是因为热流密度矢量与温度梯度矢量总是反向，为使矢量式平衡而加的。热导率的国际单位是W·m一1·K一1。热传导是通过导热载体实现的。固体的导热载体有电子、声子(晶格振动波)、光子等。热导率可表达为各种导热机制对热导率贡献的叠加“一琴合e‘。‘“式中ci、认和11分别为导热载体亥的比热、运动速度和平均自由程。每种导热机制又是其他导热机制的阻碍因素，因此固体的热传导是一个复杂的物理过程，理论上准确预侧热导率的数值及其随温度的变化比较困难。 纯金属以电子导热为主，声子导热比例很小。金属电子论表明，热导率和电导率之比与绝对温度成正比，比例系数为洛伦兹数:三拱一或立)2一2.45又1。一。(w.。.K一2) a1o一么式中叮为电导率，k为玻耳兹曼常数，e为电子电荷。这就是维德曼一夫兰兹一洛伦兹定律。室温附近对多种金属进行的实验结果与其吻合得很好。某些固体材料的热导率┌───┬──┬─────────┬────┬──┬─────┐│材料 │衅 │ 热导率 │材料 │衅 │ 热导率 ││ │(一)│(W·m一，·oC一‘)│ │(毛)│(W·m一1 ││ │ │ │ │ │ ℃一’) │├───┼──┼─────────┼────┼──┼─────┤│铝 │0 │202.4 │石棉 │ 0 │0 .151 ││铜 │0 │387 .6 │耐火砖 │204 │1 .004 ││金 │20 │292 .4 │粉状软木│37 │0 .042 ││纯铁 │0 │ 62 .3 │耐热玻璃│ 0 │1 .177 ││铸铁 │20 │ 51 .9 │冰 │29 │2 .215 ││银 │0 │418.7 │松木 │ │0 .159 ││低碳钢│0 │ 45.0 │干石英砂│ │0 .260 ││钨 │0 │159.2 │软橡胶 │ │0 .173 │└───┴──┴─────────┴────┴──┴─────┘ 绝缘体内几乎只有声子导热一种导热机制。声子导热比电子导热一般小两个数量级。合金和半导体内同时存在电子导热和声子导热两种导热机制。一般认为，金属、合金、半导体中的声子导热与绝缘体中的声子导热相仿，而它们的电导率是依次减小的，由维德曼一夫兰兹一洛伦兹定律知，金属、合金、半导体的热导率依次减小。 不同固体材料的热导率差别很大，其值主要是通过实验得到(见表)。 (何冠虎)
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条