1) advanced microetchant
新微蚀剂
3) flat etchant
光亮微蚀剂
1.
We developed a flat etchant PM-05 in view of this demand.
随着欧盟ROSH指令的实施,印制电路板(PCB)的可焊性涂覆层由热风整平(HASL)工艺转向化学沉镍金、化学沉锡和化学沉银工艺,同时表面安装技术要求化学镀层具有很高的平坦性,针对这一需求我们开发了一种铜面光亮微蚀剂PM-05。
4) new compound inhibitor
新型复配缓蚀剂
5) microetch
微蚀
1.
The influences of microetch,temperature and pH on deposit were discussed,and hence some suitable process conditions were obtained as follows: an optimum microetch solution of a mixed solution with the volume ratio of hydrogen peroxide to sulfuric acid being 1∶4,an optimum temperature 85～90 ℃ an.
通过讨论温度、pH对镀层的影响,确定最佳微蚀液为双氧水与硫酸的体积比为1∶4的混合液,镀镍与镀金最佳温度都为85~90℃,最佳pH分别为4。
2.
Introduce one-step microetch cleaner ST-10 for photoresist adhesion and it s performances.
介绍同时具有除油、微蚀和防氧化三重功效的一步法干膜前处理液ST-10的组成、工艺及其性能。
3.
The factors which affect hydrogen peroxide s decomposition and the mechanism of hydro-gen peroxide s stabilization in microetchant has been described.
分析微蚀液中影响H_2O_2分解的因素,探讨其稳定机理。
补充资料：水泵气蚀(见空化与空蚀)
水泵气蚀(见空化与空蚀)
shuibeng qishi水泵气蚀见空化与空蚀。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条