1) hole-blocking materials
空穴阻挡材料
1.
We have fabricated white organic light-emitting devices (WOLEDs) using Alq3,TPBi and BCP as different electron-transporting and hole-blocking materials,respectively.
采用Alq3、TPBi和BCP分别作为电子传输材料和空穴阻挡材料,制备了三种器件,研究了用不同的空穴阻挡材料对器件性能的影响。
2) hole blocking
阻挡空穴
4) hole blocking layer
空穴阻挡层
1.
The doping concentration between the host and guest and the thickness of hole blocking layer BCP on the the properties of light-emitting devices were separately studied.
分别研究了主客体掺杂浓度和空穴阻挡层BCP的厚度对器件发光性能的影响,当掺杂浓度为8%时,主客体间的能量传转移最充分,器件的启亮电压为5V,器件在20V时的亮度为7122。
5) hole-blocking characteristics
空穴阻挡特性
1.
The hole-blocking characteristics and luminescent properties of organic light emitting materials DPVBi were discussed.
本文利用DPVBi的空穴阻挡特性和发光特性制作了一个白光器件。
2.
The hole-blocking characteristics of organic light emitting materials DPVBi were discussed.
讨论了有机发光材料4,4-′b is(2,2-′d iphenyl vinyl)-1,1-′b iphenyl(DPVB i),在结构为ITO/N,N-′b is-(1-naphthyl)-N,N-′d iphenyl-1,1-′b iphenyl-4,4-′d iam ine(NPB)/DPVB i/tris-(8-hydroxyqu inoline)alum inum(A lq3)/L iF/A l的有机电致发光器件中所表现出来的空穴阻挡特性。
6) barrier material
阻挡层材料
1.
The key technologies,such as barrier material,Cu electroplating and CMP(chemical mechanical polishing)are analyzed and discussed.
对Cu互连技术中的阻挡层材料、电化学镀Cu技术以及化学机械抛光技术等一系列关键工艺技术进行系统的分析和讨论。
2.
To the same barrier material,the via hole with different slope has been simulated.
利用三维有限元模型对Cu互连线通孔进行了电流密度、温度和温度梯度的分布进行了模拟 ,比较了具有不同阻挡层材料的通孔内的电流密度、温度和温度梯度的分布 。
补充资料：阻挡
1.阻止﹔拦住。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条