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1)  SPS reactive sintering
SPS反应烧结
2)  spark plasma sintering
SPS烧结
1.
In this paper the nanostructured WC-Co powder is fabricated by high-energy ball milling, and also consolidated by spark plasma sintering (SPS) subsequently.
经过SPS烧结后,合金中的WC相的晶粒尺寸可以保持在300nm左右,而Co多以fcc结构出现。
2.
Ca_3Co_4O_9 ceramics were prepared by sol-gel method and spark plasma sintering(SPS)technique.
此外,Ca_3Co_4O_9块体表现出典型的半导体电学特征,电导率随着SPS烧结温度和测量温度的升高而增大,当SPS烧结温度为850℃时,P型Ca_3Co_4O_9化合物在700℃有最大电导率。
3)  SPS
SPS烧结
1.
Effects of Powders' Pretreatment and Alloy-Dissolution on Ti(CN)-Based Cermets Sintered by SPS
粉末预处理和合金固溶对SPS烧结Ti(CN)基金属陶瓷的影响
2.
After heat treatment, the precursor was sintered by SPS process.
该前驱物在700~800℃预烧2h后,采用SPS烧结。
4)  reaction sintering
反应烧结
1.
Microstructure and properties of Mo_2FeB_2 cermets clad layer by reaction sintering;
反应烧结三元硼化物金属陶瓷覆层的组织与性能
2.
Densification of laser ignited reaction sintering of Ni-Al-Cu powder alloy;
Ni-Al-Cu粉末合金激光点火反应烧结的致密化研究
3.
The samples prepared by general sintering and reaction sintering are investigated by XRD,SEM and other testing means for their structure and performance.
采用常规烧结法和反应烧结法烧结制品,并利用XRD和SEM等测试手段对制品的结构与性能进行了分析研究。
5)  reactive sintering
反应烧结
1.
Preparation of cemented carbide having highly oriented WC grains by reactive sintering of W-Co-Nano carbon tubes;
W-Co-纳米碳管反应烧结制备高度取向硬质合金
2.
Densification behavior during reactive sintering of compacted Ti/Al composite powders prepared by high energy ball milling;
高能球磨Ti/Al复合粉体的反应烧结致密行为
3.
Temperature model of reactive sintering of Ni Al thermal spray layer;
Ni-Al喷涂层中温反应烧结的温度变化模型
6)  reaction-bonded
反应烧结
1.
Low density silicon nitride with about 55% porosity and globed macropores was prepared by reaction-bonded raw silicon powder and adding 30% in mass pore-forming agent of benzoic acid ball-like particles.
以硅粉为原料,添加质量分数为30%的成孔剂(苯甲酸)球形颗粒,反应烧结制备了气孔率为55%,具有球形宏观孔的低密度多孔氮化硅陶瓷。
2.
A near-net-shape SiC was prepared by reaction-bonded from a pure carbon perform which was fabricated by mould from graphite power as raw and phenolic resin as binder.
以石墨粉体为原料,酚醛树脂为粘接剂,采用模压成型工艺制备了全碳质素坯,反应烧结后得到S iC材料。
3.
The effects of carbon content, moulding pressure, and carbon particle size of green body on microstructure and properties of reaction-bonded silicon carbide (RBSC) have been investigated.
研究了反应烧结碳化硅陶瓷的显微组织和性能与生坯碳含量、成型压力以及碳粉粒度的关系。
补充资料:反应烧结
分子式:
CAS号:

性质:又称活化烧结或强化烧结。通过添加物的作用,使反应与烧结同时进行的一种烧结方法。此法与普通烧结法比较,有如下两个主要特点:(1)提高制品质量,烧成的制品不收缩,尺寸不变化;(2)反应速度快,传质和传热过程贯彻在烧结全过程。普通烧结法物质迁移过程发生在坯体颗粒与颗粒的局部,反应烧结法物质迁移过程发生在长距离范围内。分为液相反应烧结和气相反应烧结两类。采用前一类的居多。例如,烧结氧氮化硅坯件时添加硅、二氧化硅和氟化钙(或氧化钙、氧化镁等,玻璃相形成剂)同氮反应生成二氮氧化二硅(Si2ON2),氧化钙、氧化镁等同二氧化硅形成玻璃相,氮溶解在焙融体(玻璃相)中;Si2ON2,晶体从被氮饱和的玻璃相中析出。这样制出的氧氮化硅的密度可相当于理论密度90%以上。

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