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1)  tin-copper alloying
铜-锡合金化
2)  Cu-Cr-Sn alloying
铜铬锡合金化
1.
Considering the need for raising the matrix hardness of HFC4GA1, Cu-Cr-Sn alloying process, high-efficiency compound inoculation technique, as well as the performance of the alloy before and after alloying were investigated, and some analysis techniques were employed, such as the photoelectric direct-reading spectrometer, on-line monitoring and Leitz MM6 metallographic micros.
针对提高HFC4GA1无缸套汽油发动机缸体硬度等力学性能指标,借助于光电直读光谱仪炉前在线检测、LeitzMM6金相显微镜观测等测试分析技术,对铜铬锡合金化工艺、高效复合孕育工艺技术以及合金化前后的缸体组织性能开展较系统深入研究。
3)  cyanide copper-tin alloy electroplating
氰化镀铜锡合金
1.
In this papet,the reasons of coating burr in cyanide copper-tin alloy electroplating were analyzed.
对氰化镀铜锡合金过程中镀层出现毛刺的原因进行了分析,并提出了解决问题的方法。
4)  Cu-Sn alloy
铜锡合金
1.
Electroplated Cu-Sn alloy coating is good in decoration and solderability,low in cost,non-toxic,not irritable,etc.
电镀铜锡合金具有装饰性好、可焊性优良、成本低、无毒、不使人体过敏等优点,而得到广泛的应用。
2.
The method use SCR continuous casting-rolling system to make conducting wire(Cu-Sn alloy rod) for railway application was introduced.
介绍了采用SCR连铸连轧生产线生产高速电气化铁路接触网线用铜锡合金线坯的方法,用该法生产的产品,具有内部组织细小,均匀的晶粒,强度高,软化温度高,平直度好,耐摩性好,抗蠕变性好等特点。
3.
The paper describes the process ofφ20mm Cu-Sn alloy wirebar production in continuous casting and roiling process,analyzes the impact of the wirebar s oxygen and tin content distribution on production stability, describes the cold-forming process of contact wire manufacturing by drawing machine,and studies and compares anti-drawing strength and extension capability of it.
介绍了采用连铸连轧工艺生产φ20mm铜锡合金线坯的过程,分析了线坯氧含量、锡含量对生产稳定性的影响。
5)  tin-copper alloy
锡铜合金
1.
A method to directly determine the tin in the plating bath for a novel acidic bright tin-copper alloy coating was established based on releasing back titration, which was aiming at eliminating the reference of Cu 2+ and preventing the Sn 2+ and Sn 4+ from hydrolysis.
为消除Cu2+的干扰,防止Sn2+,Sn4+的水解,建立了一套采用解蔽返滴定法,不经分离对新型酸性光亮镀锡铜合金镀液中的锡进行测定的分析方法。
2.
Minim copper in new acidic bright tin-copper alloy plating bath was determined by spectrophotometrie method using 2-(5-bromo-2-pyridylazo)-5-diethylaminophenol(5-Br-PADAP)as chromogenic reagent,and measuring wavelength was optimized.
采用 5 -Br -PADAP光度法测定酸性光亮镀锡铜合金液中的微量铜 ,优选出最佳测定波长。
3.
By sintering the tin-copper films electroplated from an alkaline solution under different temperatures, several kinds of the tin-copper alloy negative electrodes were prepared.
将碱性镀液中制备的锡-铜膜在不同温度下烧结,制得几种锡铜合金负极材料。
6)  Sn-Cu alloy
锡-铜合金
补充资料:电镀铜锡合金
分子式:
CAS号:

性质:铜锡合金镀层,又称青铜镀层,是目前我国使用最广,生产规模最大的合金镀层。根据合金中锡含量的不同,可分低锡青铜镀层(含锡量为2%~15%)、中锡青铜镀层(含锡量16%~23%)和高锡青铜镀层(含锡量为40%~50%)。其中含锡量为6%~12%的铜锡合金镀层,质地柔软,硬度和孔隙率低,并具有很好的抛光性能,耐蚀性和耐磨性比铜镀层好,可以直接镀镍和套铬,广泛用于钢铁件防腐蚀的底镀层。将铜/镍/铬镀层体系用铜锡/铬代替,可节省用镍。它广泛用于轻工、仪表、机械、通讯、家用电器、手工业等工业部门。低锡青铜镀层的电镀液主要是氰化物溶液,添加光亮剂也可以得到不需抛光便可直接镀铬的光亮低锡青铜镀层。其他青铜镀层应用较少。

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