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1)  Low-temperature vessels brazed
低温容器,钎焊
2)  soldering [英]['sɔldə]  [美]['sɑdɚ]
低温钎焊
1.
The low temperature bonding between 95%Al2O3 ceramics and 45 steel was realized through first electroless Ni-P plating on Al2O3ceramic blocks and then soldering them to steel blocks with a low melting point filler metal of 63Sn-34Pb-2Ag-1Bi alloy.
采用化学镀Ni-P膜法金属化Al2O3陶瓷,并用63Sn-34Pb-2Ag-1Bi钎料膏实现了95%Al2O3陶瓷与45钢之间的低温钎焊。
2.
Process of electroless copper plating on Al_2O_3 ceramics and its soldering at low temperature;
进行了镀铜后Al2O3陶瓷低温钎焊工艺试验,研究了不同化学镀工艺条件对接头组织及力学的影响。
3)  brazed vessels
钎焊容器
4)  laser microsoldering
激光低温钎焊
1.
In this paper, a numerical simulation of thermal process on the SMT laser microsoldering joint has been developed, in which, the influence on thermal process of the factors such as the thermal conductivity, variation of solder with temperature, light reflection coefficient of the lead wire surface, and heat exchange on the surface of SMT materials have all been considered.
本文在实验与分析的基础上,建立了表面组装激光低温钎焊接合部温度场数值计算模型,考虑了钎料的热物理性质变化、激光的实际能量分布和在钎焊材料表面的反射损失以及表面散热对热过程的影响,试验验证了该模型的正确性。
5)  Low-temperature aluminum solder
低温铝钎焊料
6)  Design,brazed vessels
设计钎焊容器
补充资料:低温容器
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性质:设计温度低于或等于某规定值(一般为-20℃)的压力容器,如液氨贮槽等。有关低温容器的设计、制造、检验和验收,在国家《钢制压力容器》规范中有明确规定。

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