1) E plane T-junction
e面t形接头
2) E-plane T-junction
E面T型接头
3) E-H T junction
E-H面T型波导接头
4) H plane T-junction
h面T形接头
5) T joint
T形接头
1.
T joints fatigue strength improving by hybrid heat treatment process after tungsten inert-gas arc remelting;
基于TIG电弧重熔的焊后复合处理工艺改善T形接头疲劳强度的研究
2.
Microstructure and properties of T joint by EBW-brazing hybrid welding;
电子束焊—钎焊复合焊T形接头组织性能分析
3.
Influence of welding sequence of subsection welding on residual stress of T joint;
分段焊的焊接顺序对T形接头残余应力场的影响
6) T-joint
T形接头
1.
Temperature and stress distribution of multi-pass welded T-joint was simulated using ABAQUS codes.
应用ABAQUS软件,对多道焊T形接头的温度场和应力场进行了数值模拟。
2.
The principle of fusion-through welding of metal, fusion-through welding technology of T-joint and its application in aviation & aerospace industries are introduced in this paper.
对金属熔透焊原理以及T形接头熔透焊技术进行了介绍,并列举了其在航空航天工业中的应用情况。
补充资料:[3-(aminosulfonyl)-4-chloro-N-(2.3-dihydro-2-methyl-1H-indol-1-yl)benzamide]
分子式:C16H16ClN3O3S
分子量:365.5
CAS号:26807-65-8
性质:暂无
制备方法:暂无
用途:用于轻、中度原发性高血压。
分子量:365.5
CAS号:26807-65-8
性质:暂无
制备方法:暂无
用途:用于轻、中度原发性高血压。
说明:补充资料仅用于学习参考,请勿用于其它任何用途。
参考词条