1) Package tabel
封装片
2) IC packaging
芯片封装
1.
Finite element analysis of high acceleration and high precision stage for IC packaging;
面向芯片封装高加速度高精度气浮定位平台的有限元分析
2.
Based on the AC permanent magnetic synchronous linear motor in IC packaging devices, the fundamental principle of linear motor is introduced and a simple but effective model is established.
针对高速高精芯片封装平台的交流永磁直线同步电机驱动系统,阐述直线电机运行的基本机理,并建立简洁实用的数学驱动模型。
3) Surface Mount Device(SMD)
贴片封装
1.
All the packaging of its components are Surface Mount Device(SMD),and we use software to instead of some hardware circuits.
它所有的器件采用贴片封装,用软件来代替部分硬件电路。
4) packing and substrate
封装基片
1.
The rapid development of micro-electron industry makes the requirement for electronic packing and substrates materials improve, people must prepare high-quality low temperature cofired packing and substrates materials.
微电子工业的飞速发展使人们对电子封装基片材料的要求越来越高，必须制备出高质量的低温共烧封装基片材料，玻璃/莫来石复合材料是一种重要的低温共烧封装基片材料，国内对这方面的研究还比较少。
5) wafer level micropackaging
芯片微封装
1.
In this paper, a novel packaging structure model which is performed using wafer level micropackaging on the thin silicon substrate as the Ka band distributed MEMS phase shifters wafer with vertical feedthrough is presented.
本文提出一种适用于Ka波段分布式MEMS移相器的新型封装结构——具有垂直互连线的薄硅作为分布式MEMS移相器衬底,并用芯片微封装方法对移相器进行封装。
6) WLP
圆片级封装
1.
Wafer Bumping Technology for WLP;
圆片级封装的凸点制作技术
2.
Wafer-Level Packaging(WLP) technology has become the important composition of advanced packaging technology, which is able to produce economic benefits of scale in batch process for die packaging.
圆片级封装(Wafer-LevelPackaging,WLP)已成为先进封装技术的重要组成部分,圆片级封装能够为芯片封装带来批量加工的规模经济效益。
补充资料：封装
分子式：
CAS号：
性质：一种处置毒性废物的方法。是将毒性废物铸入某些类似混凝土的材质中，使之与外界隔离，不污染水，并有抑制毒性作用。如将放射性废物封装在玻璃制品内，然后再存放在安全处。
CAS号：
性质：一种处置毒性废物的方法。是将毒性废物铸入某些类似混凝土的材质中，使之与外界隔离，不污染水，并有抑制毒性作用。如将放射性废物封装在玻璃制品内，然后再存放在安全处。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条