1) Ag-Sn alloy
Ag-Sn合金
1.
However, there is a little report on the oxidation mechanism of Ag-Sn alloy and how to resolve the problem on bad process ability of Ag-SnO_2 materials.
但是,关于Ag-Sn合金的内氧化机理以及如何解决Ag-SnO_2材料加工性能差的研究却比较少。
2) Sn/Ag/alloy
Sn-Ag合金
3) Sn-Ag-Cu alloy
Sn-Ag-Cu合金
1.
Studies on electrodeposition behavior of Sn-Ag-Cu alloy;
Sn-Ag-Cu合金电沉积行为的研究
2.
The electroplating process for Sn-Ag-Cu alloy coatings in weak acid bath is optimized.
对弱酸性甲磺酸盐-碘化物电镀Sn-Ag-Cu合金工艺进行了优化,镀层光亮、致密、平整,阴极电流效率提高到25%左右。
3.
The effect of the concentrations of main salts and the process conditions on the compositions,and the morphologies of Sn-Ag-Cu alloy electrodeposits were investigated by X-ray fluorescence(XRF) and scanning electron microscopy(SEM).
研究表明,Sn-Ag-Cu合金的电沉积是正则共沉积。
4) Ag-Cu-Sn-In alloy
Ag-Cu-Sn-In合金
5) Ga-Ag-Sn alloy
Ga-Ag-Sn合金
6) Ag-Cu-In-Sn alloy
Ag-Cu-In-Sn合金
补充资料：[3-(aminosulfonyl)-4-chloro-N-(2.3-dihydro-2-methyl-1H-indol-1-yl)benzamide]
分子式：C16H16ClN3O3S
分子量：365.5
CAS号：26807-65-8
性质：暂无
制备方法：暂无
用途：用于轻、中度原发性高血压。
分子量：365.5
CAS号：26807-65-8
性质：暂无
制备方法：暂无
用途：用于轻、中度原发性高血压。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条