3) electroless copper
化学镀铜
1.
The disadvantages of common electroless copper plating process were pointed out.
通过对铜原子结构的分析,提出了得到良好结合力的化学镀铜层的可能性,进而给出了使用"考本"液在钢铁上直接化学镀铜的工艺。
4) electroless Cu plating
化学镀铜
1.
Satisfactory colored-films on iron craftworks were obtained by coloring process of electroless Cu plating at room temperature and chemical coloring in turn.
在铁制工艺品上先进行常温化学镀铜然后进行着色处理,获得了效果满意的着色层。
2.
The stability of the electroless Cu plating solution is higher and the deposition rate is 2.
研究了影响化学镀铜镀速和溶液稳定性的各因素 ,根据实验确定了适宜的化学镀铜液的配方及工艺规范。
5) chemical copper plating
化学镀铜
1.
Copper was reduced by formaldehyde which was contained in the effluent of chemical copper plating, and EDTA in the effluent was reclaimed after acidify.
探讨了利用原化学镀铜废液中的甲醛将铜还原 ,后酸化回收 EDTA的新工艺。
6) electroless plating copper
化学镀铜
1.
The effect of preparation process,content and particle size of graphite,additive elements,electroless plating copper coating technology on properties of the materials are reviewed,and friction and wear behavior of copper-graphite slid- ing contact materials is discussed.
综述了铜-石墨滑动触头材料的研究进展,包括制备工艺、石墨含量、石墨粒度、添加组分和化学镀铜包覆石墨因素对铜-石墨材料性能的影响以及铜石墨材料的摩擦学问题,最后指出了铜-石墨自润滑触头材料的发展趋势。
2.
The results indicate that the optimum process for the electroless plating copper is at temperature of 65 ℃ and in pH of 12.
采用化学镀方法对平均粒度为3μm的钼粉进行化学镀铜,温度和pH值分别控制在55~75℃和11。
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