1) ground pre—assembly
地面预组装
2) pre-organization
预组装
1.
Computer simulation study on the pre-organization system of molecular imprinted polymer;
分子印迹聚合物预组装体系计算机模拟
2.
Computer simulation on thermodynamic equilibriums of Leu-Phe molecular imprinted polymer s pre-organization system;
Leu-Phe分子印迹预组装体系热力学平衡的计算模拟
3) Prepared Assembly
预制组装
1.
The Trend of Prepared Assembly in House Decoration;
对家居装修预制组装化趋势的探讨
4) preassembled group
预装组件
5) interfacial assembly
界面组装
1.
Based mainly on our own research work, nanoarchiectures with controllable compositions and structures can be obtained by using layer by layer assembly and interfacial assembly techniques.
基于自己的研究工作 ,阐述了如何利用层状组装和界面组装技术来构筑组成和结构可控的纳米组装体 ,进而制备纳米器件的方法 。
2.
The Interfacial assembly technology has the following advantages: (1) The monolayers of coordination polymers were prepared by an interfacial coordination reaction between ligands and sub-phase ion are a specific supramolecular structure,and are contrallable.
通过界面组装的分子材料具有如下的特点:(1)气液界面上Langmuir单分子膜与亚相中的离子反应可实现粒子大小的控制,形成特定的超分子结构。
6) SMT
表面组装
1.
DFM of PCB in the Field of SMT;
表面组装印制电路板的可制造性设计
2.
The Modeling and Simulation of the Temperature Field of SMT During Reflow Soldering;
再流焊是预先在PCB(Printed Circuit Board)板的焊接部位(焊盘)放置适量和适当形式的焊料,然后贴放表面组装元器件,经固化(在采用焊膏时)后,再利用外部热源使焊料再次流动达到焊接目的的一种成组或逐点焊接工艺。
补充资料：设备安装前的准备工作——设备的预装配与预调整
设备安装前的准备工作——设备的预装配与预调整 | ||
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说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条