1) copper-based solder
铜基焊料
1.
Experiments were made on tungsten and copper using nickel-based solder,copper-based solder,silver-based solder and gold-based solder,the shear strength of joint and analysis of scanning electron microscopy show that diffusion layers of weld are thin and the joint have a high strength when using silver-based solder and gold-based solder braze tungsten and copper.
采用镍基焊料、铜基焊料、银基焊料、金基焊料对钨、铜进行真空钎焊实验,接头的剪切强度和扫描电镜分析表明,用银基焊料、金基焊料焊接钨、铜,焊缝扩散层薄,接头强度高,银基焊料中的活性元素钛对母材的浸润性好。
3) copper solder
铜基锡银焊料
1.
A new method for the simultaneous dissolution and determination of tin and silver in copper solder was reported.
提出了简单、快速地同时溶解及测定铜基锡银焊料中锡银的新方法。
4) brazing solder
铜焊焊料
5) copper solder
铜焊料<冶>
6) zinc spelter
锌铜焊料
补充资料：粗铜精炼浇铸生产线(大冶有色金属公司)
粗铜精炼浇铸生产线(大冶有色金属公司)
黔 粗铜精炼浇铸生产线(大冶有色金属公司)
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条