1) HDI rigid-flex
高密互联刚挠结合板
1.
The article introduced the current development status of HDI rigid-flex manufacturing in China, and presented a new production mode for HDI rigid-flex under cooperation of PCB and FPC manufacturers.
简述国内目前高密互联刚挠结合板(High Density Interconnection Rigid-Flex)的发展慨况,推荐由刚性板及挠性板厂商合作生产HDI刚挠结合板的新模式。
2) rigid-flex PCB
刚挠结合板
1.
Because it can move, bend, torsion, and implement three-dimensional wiring with a higher assembly reliability, rigid-flex PCB has been found many applications in the field of electronics products such as computer, communications, automotive, consumer electronics, instrumentation, medical machinery and aerospace.
刚挠结合板是在挠性印制板上再粘接两个刚性外层,刚性层上的电路与挠性层上的电路通过金属化孔相互连通。
2.
To enhance flexibility of rigid-flex PCB (Printed Circuit Board), the flex area is usually delaminated to two or more single layers.
为了提高刚挠结合板的挠曲次数,往往把挠性区做成两层或两层以上的分层结构。
3.
Due to this reason,rigid-flex PCB has drawn attention for its significant progress and increasing demand.
正是由于这种需求,刚挠结合板以其巨大的技术进步和不断增加的需求而获得关注。
3) Flex-rigid
刚-挠结合
1.
Design Technology for Flex-rigid PCBs;
刚-挠结合PCB设计技术
4) Flex-rigid combination technique
刚/挠结合技术
5) rigid-flex print board
刚挠板
1.
The article introduces the reason why lamination crazing are produced during the process of making rigid-flex print board with the use of no-flow prepreg.
介绍了利用不流动性半固化片在制作刚挠板压合过程中产生白斑的原因,通过对不同条件下(不同敷形材料、表面不同线路图形分布、不同压合压力、不同半固化片张数)不流动性半固化片的压合实验发现,不流动性半固化片的压合与普通半固化片无论是从压合辅材、压合压力及压合模型上来说都很大不同。
6) rigid-flex backplane
刚挠背板
1.
Anti-vibration design of rigid-flex backplane based on BP neural network and genetic algorithm
基于BP神经网络和遗传算法的刚挠背板设计
2.
Study on dynamics simulation and reliability of solder joints of rigid-flex backplane
刚挠背板动力学仿真与焊点可靠性研究
补充资料：高密
1.高大。 2.借指富贵之家﹑高门望族。 3.指汉代郑玄。郑玄是山东高密人。 4.指汉代邓禹。邓禹以功封高密侯。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条