1.
The Study on Mixture Design of Multiplex Sn-Zn System Lead-free Solder;
多元Sn-Zn系无铅钎料混料设计的研究
2.
Research on the New Lead-Free Solder Processing Properties of Brazing and Mechanical Properties;
新型无铅钎料钎焊工艺性及机械性能的研究
3.
Research on the Properties and the Interfacial Reactions of Sn-Zn-Cu(Ni) Lead-free Solders;
Sn-Zn-Cu（Ni）无铅钎料及其钎焊接头界面反应研究
4.
Study on Mechanical Property and Solder ability of SnAgCu System Lead-free Solder Alloy
SnAgCu系无铅钎料合金力学性能及钎焊性能研究
5.
Effects of different fluxes on the characteristics of Sn-Zn solders
不同钎剂对Sn-Zn系无铅钎料润湿特性的影响
6.
Research on Compressive Creep Bechavior of the Sn-Cu Lead-free Solder;
Sn-Cu无铅钎料压蠕变性能的研究
7.
Study on Compressive Creep Properties of the Sn-Zn Lead-free Solder;
Sn-Zn无铅钎料压蠕变行为的研究
8.
Development of New Flux Used for Sn-9Zn Lead Free Solder;
Sn-9Zn无铅钎料助焊剂的研究
9.
The Development and Study of Low Ag Sn-0.3Ag-0.7Cu-XBi Lead-free Solder;
Sn-0.3Ag-0.7Cu-XBi低银无铅钎料的开发与研究
10.
The Study of the Effect of Sb on Sn-0.7Cu Lead-free Solder;
Sb对Sn-0.7Cu无铅钎料性能影响的研究
11.
Investigation on Low Temperature Sn-Zn Base Lead-Free Solder Alloys
低熔点Sn-Zn系无铅钎料的研究
12.
Wettability test of Sn-0.7Cu-xAg-yBi lead-free solder
Sn-0.7Cu-xAg-yBi无铅钎料润湿性试验
13.
Investigation on fluxes for Sn-Zn-Al lead-free solder
Sn-Zn-Al无铅钎料的助焊剂研究
14.
Effect of Cu addition on Sn-9Zn lead-free solder properties
添加铜对Sn-9Zn无铅钎料性能的影响
15.
Effect of Ag content on properties of SnAgCuX lead-free solder
Ag元素含量对SnAgCuX无铅钎料性能的影响
16.
Research development of high temperature lead-free solders for electronic assembly
电子组装用高温无铅钎料的研究进展
17.
Regression analysis for Sn-Ag-Bi-Cu lead-free solder conductive properties
Sn-Ag-Bi-Cu无铅钎料导电性能回归分析
18.
Investigation of Indentation Creep Behavior of Sn-0.7Cu Lead-free Solder
Sn-0.7Cu无铅钎料的压入蠕变行为研究